Manufacturing Bits: Oct. 24

By Mark LaPedus - 24 Oct, 2017 - Comments: 0

Redefining unit measurements At a recent meeting, the International Committee for Weights and Measures (CIPM) took the next step towards the expected redefinition of four base units within the International System of Units (SI). The SI base units include the following metrics or constants--meter, kilogram, second, ampere, kelvin, mole, and the candela. Here’s the fundamental constant... » read more

Power/Performance Bits: Aug. 1

By Jesse Allen - 01 Aug, 2017 - Comments: 1

Concentrating photovoltaics Engineers at Penn State University and the University of Illinois at Urbana-Champaign tested a new concentrating photovoltaic solar system, which they say can produce over 50% more energy per day than standard silicon solar cells. In contrast to silicon solar panels, which currently dominate the market at 15 to 20 percent efficiency, concentrating photovoltaics (... » read more

Power/Performance Bits: March 14

By Jesse Allen - 14 Mar, 2017 - Comments: 0

Magnetic storage on one atom Scientists at IBM Research created a single-atom magnet and were able to store one bit of data on it, making it the world's smallest magnetic storage device. Using electrical current, the researchers showed that two magnetic atoms could be written and read independently even when they were separated by just one nanometer. This tight spacing could, the team hop... » read more

Manufacturing Bits: Oct. 4

By Mark LaPedus - 04 Oct, 2016 - Comments: 0

China’s powerful laser The Shanghai Superintense-Ultrafast Lasers Facility (SULF) in China claims to have demonstrated the world’s most powerful laser. The ultra-intense, ultra-fast laser is said to have delivered a peak power of more than five petawatts. This is supposedly the largest peak-power laser pulse ever measured on record. A petawatt is equivalent to one quadrillion watts. ... » read more

How To Build Systems In Package

By Ed Sperling - 15 Jun, 2016 - Comments: 0

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

System Bits: Nov. 18

By Ann Mutschler - 18 Nov, 2014 - Comments: 0

Phase transitions between liquid, gas Researchers from the University of Tokyo and Tokyo Institute of Technology reminded that materials change their form between three states -- solid, liquid, and gas -- depending on factors such as temperature and pressure. However, a phase transition does not necessarily occur between liquid and gas, and they can continuously transform from the one to the o... » read more

System Bits: Aug. 19

By Ann Mutschler - 19 Aug, 2014 - Comments: 0

Revealing the purity of graphene Graphene may be tough, but those who handle it had better be tender, according to researchers from Rice University and Osaka University who have come up with a simple way to spot contaminants given that the environment surrounding the atom-thick carbon material can influence its electronic performance. It is so easy to accidentally introduce impurities into ... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer