Car Industry Changing Under The Hood

By Ann Mutschler - 07 Jan, 2021 - Comments: 0

After an initial burst of autonomous activity, the automotive ecosystem regrouped, re-evaluated its goals, and is now ready to begin deploying new technologies made possible by modern development approaches and forward-looking vehicle architectures. The pandemic hurt vehicle sales in 2020, but it also gave the OEMs a chance to catch their breath. Panic over announcements from other carmakers... » read more

New Test Methods For 5G Wafer High-Volume Production

By FormFactor - 12 Oct, 2020 - Comments: 0

In order to provide the chips required for this change in the landscape, there will be a large number of changing requirements in wafer test that come out of these architectural requirements. Form Factor partnered with Intel to investigate these changes, and tested one such example of a new test methodology. In a joint collaboration with Intel to develop a test methodology for their 5G RF-So... » read more

Secure Silicon Lifecycle Management Architecture For Functional Safety

By Lee Harrison - 08 Oct, 2020 - Comments: 0

The rapid growth of electronics for automotive applications fueled by advanced ADAS systems pose new challenges for complex SoC design and Silicon Lifecycle Management (SLM) in the supply chain as well as in-field monitoring and management of the population of chips. In these modern complex devices, ensuring the correct and safe operation requires not only functional safety to check for reli... » read more

Software-Defined Vehicles

By Bryon Moyer - 03 Sep, 2020 - Comments: 1

Automobiles long ago stopped being purely mechanical systems. But as more components are electrified — and, in particular, as the drivetrain is electrified — cars are becoming software-defined vehicles. Some think of such cars as computers on wheels. But as these systems continue to evolve, adding in more assisted and semi-autonomous capabilities, that comparison is looking increasingly ... » read more

Why Safety-Critical Verification Is So Difficult

By Ann Mutschler - 15 Jul, 2020 - Comments: 0

The inclusion of AI chips in automotive and increasingly in avionics has put a spotlight on advanced-node designs that can meet all of the ASIL-D requirements for temperature and stress. How should designers approach this task, particularly when these devices need to last longer than the applications? Semiconductor Engineering sat down to discuss these issues with Kurt Shuler, vice president of... » read more

Maximizing Value Post-Moore’s Law

By Brian Bailey - 13 Jul, 2020 - Comments: 0

When Moore's Law was in full swing, almost every market segment considered moving to the next available node as a primary way to maximize value. But today, each major market segment is looking at different strategies that are more closely aligned with its individual needs. This diversity will end up causing both pain and opportunities in the supply chain. Chip developers must do more with a ... » read more

Gaps In 5G Test

By Kevin Fogarty - 20 Mar, 2019 - Comments: 0

Add one more industry to the long list that analysts expect 5G technology to disrupt—test. While the initial versions of this wireless technology will be little more than a faster version of 4G, concern is growing about exactly how to test the second phase of this technology, which will be based upon millimeter wave. A number of fundamental problems need to be addressed. Among them: T... » read more

The Challenge Of Updating Cars

By Ann Mutschler - 08 Oct, 2015 - Comments: 0

News stories about automotive hacking are becoming more common, and so is the concern about how to curb this problem. Security has become a new layer of system design complexity, and it's being taken increasingly seriously in a market that until very recently largely ignored it. That attitude is changing rapidly though, particularly with the advent of autonomous and connected vehicles. Secu... » read more

Mobile Security And The IoE

By Ernest Worthman - 06 Jul, 2015 - Comments: 0

As we climb that mobility ladder to becoming a mostly mobile society, every rung seems to expose us to more and more layers of security failings. Six billion of the seven billion people on this planet rely on a variety of mobile devices to shop, bank, interface with social media, monitor their health, and monitor their environment. Unless you are on the inside track and know better, one would t... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?