New Test Methods For 5G Wafer High-Volume Production

An exploration of over-the-air testing for 5G RF-SoC layouts.


In order to provide the chips required for this change in the landscape, there will be a large number of changing requirements in wafer test that come out of these architectural requirements. Form Factor partnered with Intel to investigate these changes, and tested one such example of a new test methodology.

In a joint collaboration with Intel to develop a test methodology for their 5G RF-SoC devices, OTA testing was explored because it could provide simpler power combining in the dense RF-SoC device layouts. A test device was selected by Intel, and a membrane was designed for this device that then included three different measurement paths.

Click here to continue reading this paper, which first appeared in February 2019.

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