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OTA On-Chip Computing That Conquers A Bottleneck In Wired NoC Architectures


New research paper titled "Wireless On-Chip Communications for Scalable In-memory Hyperdimensional Computing" from researchers at IBM Research, Zurich Switzerland and Universitat Politecnica de Catalunya, Barcelona, Spain Abstract: "Hyperdimensional computing (HDC) is an emerging computing paradigm that represents, manipulates, and communicates data using very long random vectors (aka hyp... » read more

Using Periodic Calibration Of Antennas to Ensure the Ongoing Performance Of OTA Systems


Seen or unseen, antennas are essential to virtually every aspect of our connected world. In any over-the-air application—communication, navigation, radar, and so on—signal quality is heavily dependent on the performance of the transmitting and receiving antennas. In addition, when testing any of today’s electronic devices for electromagnetic interference (EMI) and electromagnetic compatib... » read more

Over-The-Air (OTA) Test Socket And Handler Integration Technology For 5G Mass Production Testing


This paper presents the integration of socket, measurement antenna and handler for over-the-air (OTA) testing of antenna-in-package (AiP) devices using automated test equipment (ATE) for 5G applications. The design and characteristics of sockets for performing OTA testing in the radiating near field are also discussed. The paper also describes the structure of OTA handler integration using thes... » read more

SoC Verification From Pre-Fabrication To The Over-the-Air Update


The recent new of attacks on system infrastructures serves to highlight that hardware vulnerabilities in the supply chain are not only possible but inevitable if proper precautions are ignored. Verification throughout the entire supply chain is necessary to ensure the safety and security of hardware. Starting as early as the pre-fabrication stage, vulnerabilities, if left unchecked, can be an o... » read more

Hybrid System-Level Test For RF SiP


In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in-package (SiP) and even one-chip devices. Such devices increase the demand for a mass-production test environment that can measure them in a short ti... » read more

The Good And Bad Of Auto IC Updates


Keeping automobiles updated enough to avoid problems is becoming increasingly difficult as more complex electronics are added into vehicles, and as the lifetimes of those devices are extended to a decade or more. Modern vehicles are full of electronics. In fact, the value of electronic devices used in modern vehicles is expected to double in the next 10 years, growing to $469 billion by 2030... » read more

Testing AiP Modules In High-Volume Production


Far-field and radiating near-field are two options for high-volume over-the-air (OTA) testing of antenna-in-package (AiP) modules with automated test equipment (ATE) [1]. In this article, we define an AiP device under test (DUT) and examine the measurement results from both methods. Creating an AiP evaluation vehicle Proper evaluation of an ATE OTA measurement setup requires an AiP module. Us... » read more

Merging Verification And Test


While the disciplines of functional verification and test serve different purposes, their histories were once closely intertwined. Recent safety and security monitoring requirements coupled with capabilities being embedded into devices is bringing them closer together again, but can they successfully cooperate to bring about improvements in both? Getting there may be difficult. Three phases ... » read more

Car Industry Changing Under The Hood


After an initial burst of autonomous activity, the automotive ecosystem regrouped, re-evaluated its goals, and is now ready to begin deploying new technologies made possible by modern development approaches and forward-looking vehicle architectures. The pandemic hurt vehicle sales in 2020, but it also gave the OEMs a chance to catch their breath. Panic over announcements from other carmakers... » read more

New Test Methods For 5G Wafer High-Volume Production


In order to provide the chips required for this change in the landscape, there will be a large number of changing requirements in wafer test that come out of these architectural requirements. Form Factor partnered with Intel to investigate these changes, and tested one such example of a new test methodology. In a joint collaboration with Intel to develop a test methodology for their 5G RF-So... » read more

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