中文 English

Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging


The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device performance ... » read more

PCB And IC Technologies Meet In The Middle


Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will themselves be mounted on PCBs. But SMT for advanced packages isn’t the same as the SMT we’ve been used to. “Many systems include multiple ASICs, a lot of memory, and that's all integrated i... » read more

Moderating A Panel


When I was a technologist at Mentor, I used to be asked to sit on panels. I loved to provide my opinions on just about anything. As soon as I became independent, the industry believed that I could serve it better as a moderator. That was not an easy transition to make. The first few panels that I moderated were probably not very good. I like to think that I have improved over the years, and the... » read more

Reducing Advanced Packaging Costs


Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

The Big Blur


Chip companies, research houses, foundries—and more recently large systems companies—have been developing alternative technologies to continue scaling power and performance. It's still not obvious which of those will win, let alone survive, or what they will do to the economics of developing chips. For more than five decades, the biggest concern was scaling devices in order to save money... » read more

Eye-Catching Innovations In Display Subsystems


The mobile devices we hold in our hands today are nothing short of astonishing in what they deliver and how seamlessly they deliver it, and it’s not just geolocation and context-mapping applications that have made these devices so transformational. Hand in hand with processor and bandwidth improvements have come leaps in display capabilities, which means new entertainment and information appl... » read more