tag: panels

New Panel Production Efforts Target Interposer Costs
By Bryon Moyer - 20 Nov, 2025 - Comments: 0

The rising cost of increasingly large interposers is spurring renewed interest in panel-level manufacturing, which for years has hobbled along due to the massive and collective effort required by the chip industry to change formats. Several companies are developing their own processes, although there is currently no commercial production. And a new consortium called Joint3, spearheaded by Ja... » read more

The Opportunities And Challenges Of FOPLP Technology
By Teck Lee - 23 Oct, 2025 - Comments: 0

Artificial intelligence (AI) has emerged as a major catalyst for innovation and advancement. The growing demand for AI computing power is driving heterogeneous integration toward larger packaging sizes, sparking increased interest in Fan-out Panel Level Package (FOPLP) technology. This article explores ASE’s practices and developments in this area, delving into the technical intricacies and e... » read more

Today’s Screen Culture Puts Higher Pressure On Display Chips
By Liz Allan - 09 Oct, 2025 - Comments: 0

Just as cathode ray tube technology has been relegated to specialist industrial and medical settings, OLED (organic light-emitting diode) is overtaking LCD (liquid crystal display) in some applications due to its superior image quality and contrast. But OLED is not a one-size-fits-all. An array of new technologies is being developed to meet consumer demand for better, brighter screens with h... » read more

Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging
By Onto Innovation - 07 Dec, 2021 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device performance ... » read more

PCB And IC Technologies Meet In The Middle
By Bryon Moyer - 12 Oct, 2021 - Comments: 1

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will themselves be mounted on PCBs. But SMT for advanced packages isn’t the same as the SMT we’ve been used to. “Many systems include multiple ASICs, a lot of memory, and that's all integrated i... » read more

Moderating A Panel
By Brian Bailey - 27 Jun, 2019 - Comments: 0

When I was a technologist at Mentor, I used to be asked to sit on panels. I loved to provide my opinions on just about anything. As soon as I became independent, the industry believed that I could serve it better as a moderator. That was not an easy transition to make. The first few panels that I moderated were probably not very good. I like to think that I have improved over the years, and the... » read more

Reducing Advanced Packaging Costs
By Ed Sperling - 09 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

The Big Blur
By Ed Sperling - 20 Sep, 2018 - Comments: 0

Chip companies, research houses, foundries—and more recently large systems companies—have been developing alternative technologies to continue scaling power and performance. It's still not obvious which of those will win, let alone survive, or what they will do to the economics of developing chips. For more than five decades, the biggest concern was scaling devices in order to save money... » read more

Eye-Catching Innovations In Display Subsystems
By Ian Hutchinson - 04 Jan, 2018 - Comments: 0

The mobile devices we hold in our hands today are nothing short of astonishing in what they deliver and how seamlessly they deliver it, and it’s not just geolocation and context-mapping applications that have made these devices so transformational. Hand in hand with processor and bandwidth improvements have come leaps in display capabilities, which means new entertainment and information appl... » read more

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