The Week In Review: Manufacturing

By Mark LaPedus - 23 Jun, 2017 - Comments: 0

Chipmakers The NAND market is in flux. Not long ago, troubled Toshiba put its memory unit on the block. Finally, the company has selected a group to buy its memory business. The consortium includes the Innovation Network Corp. of Japan, the Development Bank of Japan and Bain Capital. Rival SK Hynix is also part of the group. Others attempted to bid on the business, including Western Digita... » read more

System Bits: April 4

By Ann Mutschler - 04 Apr, 2017 - Comments: 0

Nanodevices for extreme environments in space, on earth Researchers at the Stanford Extreme Environment Microsystems Laboratory (XLab) are on a mission to conquer conditions such as those found on Venus: a hot surface pelted with sulfuric acid rains, 480 degrees C, an atmosphere that would fry today’s electronics. By developing heat-, corrosion- and radiation-resistant electronics, the team ... » read more

Manufacturing Bits: Aug. 30

By Mark LaPedus - 30 Aug, 2016 - Comments: 0

Redefining the ampere In 2014, an international group called the BIPM agreed to redefine four common units of measurements--the kilogram, the ampere, the kelvin and the mole. These units of measurement make up the so-called International System of Units or SI. In total, there are seven SI base units—meter, kilogram, second, ampere, kelvin, mole, and the candela. Work is already under wa... » read more

Manufacturing Bits: April 5

By Mark LaPedus - 05 Apr, 2016 - Comments: 0

Food in 3D Using a technology called ptychographic X-ray computed tomography, the University of Copenhagen and the Paul Scherrer Institute have taken images of food in three dimensions and on a nanometer scale. Ptychography, a lensless coherent imaging technique, could potentially save the food industry money. It could reduce food waste due to faulty production methods. Ptychography could ... » read more

System Bits: Aug. 12

By Ann Mutschler - 12 Aug, 2014 - Comments: 0

Wearable, continuous disease monitoring A new wearable vapor sensor being developed at the University of Michigan could one day offer continuous disease monitoring for patients with diabetes, high blood pressure, anemia or lung disease, according to researchers there. The new sensor, which can detect airborne chemicals either exhaled or released through the skin, would likely be the first w... » read more

System Bits: May 13

By Ann Mutschler - 13 May, 2014 - Comments: 0

Bringing hyperbolic metamaterials closer to reality Purdue Researchers have taken a step toward practical applications for hyperbolic metamaterials, which are ultra-thin crystalline films that could bring optical advances for microscopes, quantum computers and high-performance solar cells. Optical metamaterials harness clouds of electrons called surface plasmons to manipulate and control li... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Paul Scherrer Institute

The Week In Review: Manufacturing

System Bits: April 4

Manufacturing Bits: Aug. 30

Manufacturing Bits: April 5

System Bits: Aug. 12

System Bits: May 13

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