tag: PDF Solutions

What’s Really Needed For Advanced Test?
By Greg Prewitt - 12 May, 2026 - Comments: 0

By Greg Prewitt and Marc Jacobs Advanced test has become one of the semiconductor industry's most promising frontiers: adaptive binning, feed-forward models, and real-time analytics pulling signals from mountains of measurement data. But there is a problem hiding underneath all that ambition, and it is neither compute nor algorithm; it is data. More specifically, it is the unglamorous, found... » read more

Smart Test Collides With The Data Chain
By Gregory Haley - 12 May, 2026 - Comments: 0

Key Takeaways: The promise of smart test is a data-chain problem before it is an algorithm problem. A device can pass every checkpoint and still carry a latent defect the test record never captured. As test grows more adaptive, the validity of the measurement environment matters as much as the measurement itself. For years, the test roadmap has pointed toward more adaptive f... » read more

Features And Benefits Of The SECS/GEM Standard – eBook
By PDF Solutions - 12 May, 2026 - Comments: 0

Discover how the SEMI E30 SECS/GEM standard empowers smarter, more efficient manufacturing by enabling factories to seamlessly collect equipment data, reduce integration costs, implement advanced process control, and improve overall operational performance. This eBook walks through key GEM capabilities—including collection events, alarms, recipe management, terminal services, and more—to s... » read more

Breaking The Legacy Trap: How Semiconductor Executives Can Accelerate AI Adoption And Transform IT Applications At The Same Time
By Christophe Begue - 07 Apr, 2026 - Comments: 0

The semiconductor industry is facing a strategic paradox. AI has rapidly moved from experimental technology to a competitive necessity promising faster yield improvement, smarter supply chain decisions, and autonomous factory operations. Yet the very systems that semiconductor manufacturers depend on to run their fabs, manage their supply chains, and serve their customers were built for a diffe... » read more

AI Accelerators Usher In New Era For IC Test
By Laura Peters - 07 Apr, 2026 - Comments: 0

Key Takeaways The parallelism in AI accelerators enables low latency but complicates failure isolation. HBM can account for 50% of package cost, so known-good stack assurance is critical. DFT and test cooperate to solve final test, singulated die test, SLT, and in-system test for data centers. AI accelerators are used for everything from training large language models to mak... » read more

Platform-Led AI Analytics for the Semiconductor Ecosystem
By PDF Solutions - 07 Apr, 2026 - Comments: 0

Abstract: Semiconductor manufacturers face a mounting data crisis: modern fabrication facilities generate petabytes of complex, siloed data, yet less than 5% of it is typically used in analytics. Traditional business intelligence tools lack the scalability to handle datasets with millions of parameters, leaving critical yield and quality insights untapped. In this presentation we outline a c... » read more

Challenges In Scaling Chips To 2nm And Below
By Ed Sperling - 30 Mar, 2026 - Comments: 0

Key Takeaways Scaling to 2nm and below continues due to power improvements per watt, but progress is much more challenging and costly. Solutions to problems often create other problems due to less margin for tradeoffs, often requiring larger interposers, more chiplets, and more complex packages. New levels of precision are required throughout the design-through-manufacturing flow, re... » read more

The Petabyte Problem: How AI Is Finally Making Semiconductor Manufacturing Data Actionable
By Christophe Begue - 10 Mar, 2026 - Comments: 1

The semiconductor industry has quietly accumulated one of the most complex data challenges in modern manufacturing, and it has largely been losing the battle to solve it. Modern fabs now generate gigabytes of data per chip across probe, assembly, and test operations. Test programs routinely exceed one million test items. The largest enterprise deployments have crossed the multi-petabyte thre... » read more

Tool Matching Getting Tougher Across Test & Metrology
By Laura Peters - 10 Mar, 2026 - Comments: 0

Key Takeaways Engineers leverage both device-specific and tool-level data to identify a process "sweet spot." Tight, frequent tool-to-tool matching enables greater yield and fab flexibility. Machine learning helps capture the nuances of a tool's signature. Many people outside of the semiconductor industry wonder how humans can fabricate transistors with tens of nanometer sca... » read more

Addressing Semiconductor Cybersecurity Challenges through Robust Industry Standards and Globally Secure Frameworks
By PDF Solutions - 10 Mar, 2026 - Comments: 0

This presentation addresses critical cybersecurity challenges in semiconductor manufacturing by outlining current industry standards (SEMI E187, E188, E191) and their implementation through SMCC workgroups. It identifies key gaps in existing frameworks—particularly the inadequacy of current equipment connectivity standards for distributed collaboration and the scalability challenge of custom ... » read more

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