Optical interconnect for flexible electronics

By Michael Watts - 23 Feb, 2013 - Comments: 0

By Michael P.C. Watts At Photonics West, Dow Corning and IBM disclosed a photo-patternable optical interconnect materials set that can support 25 cm interconnect lengths, can be part of a flexible PCB, and survive the industry standard “Telcordia” environmental stress test. The idea of optical interconnect has been circulating as soon as it was realized that chip to chip communication... » read more

SOI Highlights at Common Platform Tech Forum

By Various Writers - 19 Feb, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ The 2013 Common Platform Technology Forum showcased “the latest technological advances being delivered to the world’s leading electronics companies,” so of course SOI-based topics were well-represented. Happily, those of us who weren’t able to get over to Silicon Valley were able to attend “virtually” via a ... » read more

Wafer Leaders Extend Basis for Global SOI Supply

By Various Writers - 16 Oct, 2012 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ It’s a bright green light from the world leaders in SOI wafer capacity. Soitec, the world leader in SOI wafer production, and long-time partner Shin-Etsu Handatai (SEH), the world’s biggest producer of silicon wafers, have extended their licensing agreement and expanded their technology cooperation. SEH is a $12... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE ;1-4 OCT, NAPA

By Various Writers - 25 Sep, 2012 - Comments: 0

The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

SOI Conference Shows SOI Driving Key Roadmaps

By Various Writers - 21 Oct, 2011 - Comments: 0

By Adele Hars The 2011 IEEE SOI Conference, held in Tempe, AZ last week was not one to miss…but I did. Happily, I got the papers right away, along with observations shared by some of the folks who did get there. Highlights include excellent and insightful papers from ST, ARM, IBM, Intel, Leti, Peregrine and GlobalFoundries, plus many more that indicate SOI-based technologies are at th... » read more

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tag: photonics

Optical interconnect for flexible electronics

SOI Highlights at Common Platform Tech Forum

Wafer Leaders Extend Basis for Global SOI Supply

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE ;1-4 OCT, NAPA

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