Signoff Intensity On The Rise


By Ann Steffora Mutschler and Ed Sperling Lithography and signoff are crossing swords at 16/14nm and 10nm, creating new problems that raise questions about just how confident design teams will be when they sign off before tapeout — and how many respins are likely to follow. While designs at 20nm, 16nm and 14nm typically rely on colorless double patterning, at 10nm colors are mandatory. ... » read more

Reducing IC Cycle Time With Calibre


Technology is both a blessing and a curse. The same shrinking of transistor size that has enabled chip designers to place significantly more functionality on the same die area is also responsible for the significant increases we have seen in the number and complexity of verification rules. It would be nice if we could use this phenomenon to our advantage, as an excuse for why our job of physica... » read more

Newer posts →