Manufacturing Bits: April 30

By Mark LaPedus - 30 Apr, 2019 - Comments: 0

Single-atom catalysts A group of researchers have captured the behavior of a single-atom catalyst, a move that could one day help design more efficient catalysts in systems. A catalyst is a substance that increases the rate of a chemical reaction. In vehicles, for example, platinum is used as a catalyst, which speeds up chemical reactions and cleans exhaust gases. Besides platinum, the indu... » read more

Finding The Source Of EUV Stochastic Effects

By Katherine Derbyshire - 15 Apr, 2019 - Comments: 7

The next phase of EUV development has begun—making EUV more predictable and potentially more mainstream—and it's looking to be every bit as difficult and ambitious as other developments in advanced lithography. In the early days of EUV development, supporters of the technology argued that it was “still based on photons,” as opposed to alternatives like electron beam lithography. Whil... » read more

Manufacturing Bits: June 16

By Mark LaPedus - 16 Jun, 2015 - Comments: 0

Harmonic EUV The U.S. Department of Energy’s Lawrence Berkeley National Laboratory has devised an efficient extreme ultraviolet (EUV) source. The technology could one day be used for a new class of metrology tools, based on angle-resolved photoemission spectroscopy (ARPES). This technique makes use of a photoelectric effect for studying materials. To enable the source, Berkeley Labs devel... » read more

System Bits: Feb. 4

By Ann Mutschler - 04 Feb, 2014 - Comments: 0

Speeding Access To Information Big data today is usually stored on multiple hard disks on a number of machines across an Ethernet network, but this storage architecture considerably increases the time it takes to access the information. Researchers at MIT have developed a storage system for big-data analytics they claim can dramatically reduce the time it takes to access information. The sy... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: plasmons

Manufacturing Bits: April 30

Finding The Source Of EUV Stochastic Effects

Manufacturing Bits: June 16

System Bits: Feb. 4

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