Meeting Stringent PA_SaveConfigTime In UFS Solution When M-PHY Needs Higher Reconfigure Time

By Synopsys - 31 Jan, 2024 - Comments: 0

The JEDEC Universal Flash Storage (UFS) has emerged as the default mobile storage solution for high-end smartphones and battery-operated devices, owing to its superior speed, performance, and power efficiency. These attributes are essential to meet users' demand for rapid transmission and reception of high-resolution media amid myriad operations. Despite these advantages, UFS's use of the MIPI ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 09 Oct, 2015 - Comments: 0

Is the sky falling in the IC equipment market? Not yet, but watch out below. Semi capital spending is expected to reach $60.37 billion in 2015, down 1% from 2014, according to Pacific Crest Securities. “Although we trimmed 2016 capex three weeks ago, we are trimming some more. We now see semiconductor capex down 4% in 2016. However, we do not see capex falling off a cliff in 2016 (i.e., down ... » read more

Tech Talk: Cloud Power

By Ed Sperling - 29 Dec, 2014 - Comments: 0

PMC distinguished engineer Kenneth Wagner talks about the need for conserving energy in the data center as well as mobile device, and what are the best ways to accomplish that. The video was shot at the Cadence Low Power Summit. [youtube vid=tXx8-qX4vm4] » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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tag: PMC

Meeting Stringent PA_SaveConfigTime In UFS Solution When M-PHY Needs Higher Reconfigure Time

The Week In Review: Manufacturing

Tech Talk: Cloud Power