Week In Review: Design, Low Power

By Jesse Allen - 28 Apr, 2023 - Comments: 0

The National Institute of Standards and Technology (NIST) outlined its plan for a National Semiconductor Technology Center (NSTC) to be created using a share of the $11 billion in funds from the CHIPS Act marked for research and development. While a large portion of the CHIPS Act investment is set to boost U.S. fabs and manufacturing capabilities, the NSTC aims to also support the design side, ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 23 Oct, 2020 - Comments: 0

M&A Microchip Technology acquired LegUp Computing, a provider of a high-level synthesis compiler that automatically generates high-performance FPGA hardware from software. The LegUp HLS tool will be used alongside Microchip’s VectorBlox Accelerator Software Design kit and VectorBlox Neural Networking IP generator to provide a complete front-end solution stack for C/C++ algorithm develope... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 23 Aug, 2019 - Comments: 0

AI chip boom or bust? The semiconductor industry is the most bullish about adopting artificial intelligence (AI), according to a new report from Accenture. Some 77% of semiconductor executives surveyed said they have adopted AI within their businesses or are piloting the technology. In addition, 63% of semiconductor executives expect that AI will have the greatest impact on their business over... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 13 May, 2016 - Comments: 0

Chipmakers Samsung Electronics has unveiled its newest memory card globally–the EVO Plus 256GB microSD card. Based on Samsung’s 3D NAND technology, the EVO Plus 256-GB offers the highest capacity for a microSD card in its class. Consumers can now record up to 12 hours of 4K UHD video or 33 hours of Full HD video on their mobile device or action camera without needing to change or replace t... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: POET Technologies

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Manufacturing, Test

The Week In Review: Manufacturing