Fundamentals of Power Amplifier Testing


The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In this application note, you will learn the basics of testing RF PAs and FEMs through an interactive application note with multiple how-to videos. When characterizing the performance of an RF PA, engin... » read more

New Architecture Elements For 5G RF Front-End Modules To Reduce Noise, Improve Efficiency, And Allow Multiple Radio Transmitters


A technical paper titled “Circuits for 5G RF front-end modules” was published by researchers at Skyworks Solutions Inc. Abstract: "Worldwide adoption of fourth-generation wireless (4G) long-term evolution (LTE) smartphones and the actual transition to fifth-generation wireless (5G) is the main driving engine for semiconductor industry. 5G is expected to reach high data rate speeds (1 Gbps... » read more

EDA Software Design Flow Considerations For The RF/Microwave Module Designer


Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other discrete components within a unifying substrate for use as a single component. This white paper outlines the steps for implementing an... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design


In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

Load-Pull Analysis For Optimizing PA Performance


In load pull calculations, power amplifiers are going to need harmonic load pull analysis and load pull contours with wideband electromagnetic tuners. Working with RFIC power amplifiers is difficult for the myriad of concurrent design elements that they affect, transmission line voltage, signal interference, and impedance to name a few. In load pull calculations, power amplifiers are going t... » read more

5G NR Primer For Amplifier And Filter Design


This primer examines some of the challenges engineers face when designing filters and power amplifiers for 5G New Radio (NR) communication systems. See how the Cadence AWR Design Environment platform can be used to simulate amplifier and filter performance under 5G operating conditions. Click here to continue reading.     » read more

Week In Review: Manufacturing, Test


Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

How 5G Affects Test


David Hall, head of semiconductor marketing at National Instruments, talks with Semiconductor Engineering about architectural changes to infrastructure due to the rollout of 5G and how the move from macrocells to small cells is changing test requirements.         Subscribe to Semiconductor Engineering's YouTube Channel here » read more

CMOS And SOI Invade RF Front End


By Mark LaPedus The next-generation 4G wireless standard known as long-term evolution (LTE) presents some new and difficult design choices for OEMs. One of the more difficult choices involves the less glamorous, but arguably the most critical part in a handset—the radio-frequency (RF) front-end. Typically, the RF front-end often comes in a module and includes various key components, such ... » read more