Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration


New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

Effect of Different Frequency Scaling Levels on Memory in Regard to Total Power Consumption in Mobile MPSoC


New technical paper titled "CPU-GPU-Memory DVFS for Power-Efficient MPSoC in Mobile Cyber Physical Systems" from researchers at University of Essex, Nosh Technologies, and University of Southampton. Abstract "Most modern mobile cyber-physical systems such as smartphones come equipped with multi-processor systems-on-chip (MPSoCs) with variant computing capacity both to cater to performance r... » read more

Electronics And Sustainability: Can Smart Engineering Save The Planet?


We just celebrated Earth Day 2022 with great fanfare. In discussions with my favorite Gen Z family member, I sense genuine concerns that sustainability goals seem like a tall order. Let’s review the contributions the electronics industry can make to sustainability. First, defining sustainability seems to lead to three main pillars—environmental, social, and economic sustainability. I fou... » read more

Always-On Sub-Microwatt Spiking Neural Network Based on Spike-Driven Clock- and Power-Gating for an Ultra-Low-Power Intelligent Device


Abstract: "This paper presents a novel spiking neural network (SNN) classifier architecture for enabling always-on artificial intelligent (AI) functions, such as keyword spotting (KWS) and visual wake-up, in ultra-low-power internet-of-things (IoT) devices. Such always-on hardware tends to dominate the power efficiency of an IoT device and therefore it is paramount to minimize its power diss... » read more

Run Realistic Software For Full Chip Power Signoff


In the real world, the demand for AI chips is driving the trend towards bigger, smarter, and faster SoC designs. Consequently, low-power design, analysis, verification, and power signoff challenges are not getting any easier as chip designs deploy increasingly smaller geometries that dissipate more and more power. Despite this dilemma, the quest for further power reductions continues apace. ... » read more

Solution Efficiencies For Dynamic Function eXchange Using Abstract Shells


Dynamic Function eXchange (DFX) enables great flexibility within Xilinx® silicon, empowering you to load applications on demand, deliver updates to deployed systems, and reduce power consumption. Platform designs allow for collaboration between groups, where one group can focus on infrastructure and another on hardware acceleration. However, DFX has fundamental flow requirements that lead to l... » read more

PF-DRAM: A Precharge-Free DRAM Structure


Authors: Nezam Rohbani † (IPM); Sina Darabii § (Sharif); Hamid Sarbazi-Azad † i §(Sharif / IPM): † School of Computer Science, Institute for Research in Fundamental Sciences (IPM), Tehran, Iran § Department of Computer Engineering, Sharif University of Technology, Tehran, Iran Abstract: "Although DRAM capacity and bandwidth have increased sharply by the advances in technology ... » read more

Know Your Own Power, Early And Accurately


By Taruna Reddy and Vin Liao Chip designers have always had to balance timing and area. Everyone wants a design as fast as possible and as compact as possible, but these two goals are usually in conflict. For the last couple of decades, minimal power consumption has been a third goal, often of equal importance. Some of the biggest drivers for the semiconductor industry are battery operated p... » read more

Addressing Power Challenges In AI Hardware


Artificial intelligence (AI) accelerators are essential for tackling AI workloads like neural networks. These high-performance parallel computation machines provide the processing efficiency that such high data volumes demand. With AI playing increasingly larger roles in our lives—from consumer devices like smart speakers to industrial applications like automated factories—it’s paramount ... » read more

Von Neumann Upset


My recent article about the von Neumann architecture received some quite passionate responses, including one that thought I was attempting to slight the person. That was most certainly not the intent, given that the invention enabled a period of very rapid advancement in computers and technology in general. The process of invention and engineering are both quite similar and yet different. In... » read more

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