On The Ground At ECTC 2025


Senior Executive Editor Laura Peters examines the the hot topics at last week's IEEE's Electronic Components and Technology Conference, including the impact of hardware-software integration on power consumption, co-packaged optics, hybrid bonding, and fan-out panel-level packaging. https://youtu.be/yBDKqrPQBl4   » read more

Offline RL Framework That Dynamically Controls The GPU Clock And Server Fan Speed To Optimize Power Consumption And Computation Time (KAIST)


A new technical paper titled "Power Consumption Optimization of GPU Server With Offline Reinforcement Learning" was published by researchers at Korea Advanced Institute of Science and Technology (KAIST) and KT Research and Development Center. "Optimizing GPU server power consumption is complex due to the interdependence of various components. Conventional methods often involve trade-offs: in... » read more

Digital Twins For Design And Verification Workflows


Experts At The Table: AI is starting to impact several parts of the EDA design and verification flows, but so far these improvements are isolated to a single tool or small flows provided by a single company. What is required is a digital twin of the development process itself, on which AI can operate. Semiconductor Engineering sat down with a panel of experts, including Johannes Stahl, senior d... » read more

Silicon Reimagined: New Foundations For The Age of AI


The semiconductor industry is undergoing a pivotal transformation driven by the rise of artificial intelligence (AI) and the slowing of traditional Moore’s Law scaling.  In this comprehensive 42 page report, several key trends shaping the industry’s future are highlighted. The push toward more specialized architectures tailored for specific workloads, particularly in AI. The critic... » read more

Uncore Frequency Scaling For Energy Optimization In Heterogeneous Systems (UIC, Argonne)


A new technical paper titled "Exploring Uncore Frequency Scaling for Heterogeneous Computing" was published by researchers at University of Illinois Chicago and Argonne National Laboratory. Abstract "High-performance computing (HPC) systems are essential for scientific discovery and engineering innovation. However, their growing power demands pose significant challenges, particularly as sys... » read more

Why Your Data Center Needs a Digital Twin


The global digital twin market is on a rapid ascent, projected to skyrocket from $11.51 billion in 2023 to $137.67 billion by 2030. Spanning industries from aerospace to healthcare, digital twins are becoming an essential tool for efficient management. But what is a digital twin? Essentially, it’s a digital replica of any real-world entity—a product, system, or process—used for simulation... » read more

Lower Your Power Consumption For Battery-Operated Smart Devices


Striking the right balance between battery life and customer experience The number of connected smart home battery-operated devices is expected to grow as consumers look for new ways to retrofit their homes with IoT devices without power cabling. This change leaves device makers in search of new ways to make their battery-operated smart home products more power-efficient at all levels, while st... » read more

Where Power Savings Really Count


Experts at the Table: Semiconductor Engineering sat down to discuss why and where improvements in architectures and data movement will have the biggest impact, with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice presi... » read more

IC Power Optimization Required, But More Difficult To Achieve


Power optimization is playing an increasingly vital role in chip and chip and system designs, but it's also becoming much harder to achieve as transistor density and system complexity continue to grow. This is especially evident with advanced packages, chiplets, and high-performance chips, all of which are becoming more common in complex designs. Inside data centers, racks of servers are str... » read more

Making Sensors More Reliable


Experts at the Table: Semiconductor Engineering sat down to talk about the latest issues in sensors with Prakash Madhvapathy, director of product marketing, Tensilica audio/voice DSPs group at Cadence; Kevin Hughes, senior product manager for MEMS sensors at Infineon; and Matthew Hogan, product management director at Siemens EDA. What follows are excerpts of that conversation. [L-R] Kevin ... » read more

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