Sustainable Rail Transportation With High Power SiC Modules: Part 2

By Diana Car - 10 Oct, 2024 - Comments: 0

In the first part of this blog, we had a look at how energy-efficient high-power modules contribute to the decarbonization of railway transportation. This part will focus on the future of traction: high-power silicon carbide modules, their key features, and the multiple system benefits they enable. Silicon carbide power modules and hybrid-propulsion trains: It’s a match! As we inch toward... » read more

Sustainable Rail Transportation With High Power SiC Modules: Part 1

By Diana Car - 05 Sep, 2024 - Comments: 0

The process of electrification of railways, though crucial for achieving net-zero climate targets, is nevertheless far from being complete. Let's delve into how high-power semiconductor technologies are accelerating the decarbonization of rail transport, making it cleaner, safer, and smarter. Decarbonization of transportation: Unraveling the global picture According to the International Ene... » read more

Cooling Technology For Next Gen Power Electronics

By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Advances in Two-Phase Cooling for Next Power Electronics Converters" was published by researchers at ROMA TRE University, ENEA Casaccia Research Center and Sapienza University. "The proposed arrangement allows a greater extraction of the heat at a very low flow rate of the cooling fluid, even with standard industrial-grade heat-sinks, which motivates the use of ... » read more

Driving Cost Lower and Power Higher With GaN

By Anne Meixner - 06 Aug, 2024 - Comments: 0

Gallium nitride is starting to make broader inroads in the lower-end of the high-voltage, wide-bandgap power FET market, where silicon carbide has been the technology of choice. This shift is driven by lower costs and processes that are more compatible with bulk silicon. Efficiency, power density (size), and cost are the three major concerns in power electronics, and GaN can meet all three c... » read more

SiC Power Electronics Packaging: Floating Die Structure and Liquid Metal Fluidic Connection (Cambridge U. )

By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging" was published by researchers at Cambridge University. Abstract "Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electroni... » read more

Automotive Semiconductors Require Integrated Test Solution

By Toni Dircherl - 09 Jul, 2024 - Comments: 0

The automotive semiconductor test market is experiencing organic growth as chipmakers produce higher volumes of devices serving an array of automotive applications. In addition, the range of applications for automotive-grade semiconductors is evolving as the technology advances. Manufacturers of automated test equipment (ATE) are adapting to ensure their systems can handle devices ranging from ... » read more

Power Stage Selection Considerations For High-Current Voltage Regulators

By Tammie Bard - 02 Jul, 2024 - Comments: 0

There are several key things to consider when selecting a power stage for high-current voltage regulators: What area does the power stage need to fit in? What is the continuous output current? What is the maximum peak current? This should not exceed the peak current rating of the power stage. What is the power loss for sustained output current? This can be calculated... » read more

Liquid Cooling And GaN: A Winning Combination

By Paul Wiener - 06 Jun, 2024 - Comments: 0

Data centers are facing an unprecedented transformation due to the surge in generative AI and other emerging technologies. A single ChatGPT session consumes 50 to 100 times more energy than a comparable Google search, escalating data center rack power requirements towards 200 kW or more, presenting serious challenges for operators. Cooling, in fact, takes up about 40% of the power requireme... » read more

Efficient Electronics

By Andy Heinig - 16 May, 2024 - Comments: 0

Attention nowadays has turned to the energy consumption of systems that run on electricity. At the moment, the discussion is focused on electricity consumption in data centers: if this continues to rise at its current rate, it will account for a significant proportion of global electricity consumption in the future. Yet there are other, less visible electricity consumers whose power needs are a... » read more

Optimize Power For RF/μW Hybrid And Digital Phased Arrays

By Kimia Azad - 09 May, 2024 - Comments: 0

Field-programmable gate arrays (FPGAs) are a critical component of both digital and hybrid phased array technology. Powering FPGAs for aerospace and defense applications comes with its own set of challenges, especially because these applications require higher reliability than many industrial or consumer technologies. This blog post will provide a brief history on beamforming and beam-steeri... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?