When Less Can Be More With Smart Module Design: Part 1


Size and power often seem like opposite sides of a coin. When you reduce size – one of the ever-pressing goals in our industry – you inevitably reduce power. But does that have to be the case? By shifting our thinking from the chip to the module design, there’s no need to flip a coin. In IGBT modules, chip shrinkage leads to an increased thermal impedance, which then impacts performanc... » read more

A Solar Solution For Every Situation


Regardless of where they are used, energy conversion efficiency is paramount in solar power applications (if you are interested in their technical details, here is a blog post for you). Even small improvements reduce energy waste, decrease operating costs, lower spatial and cooling systems requirements, and much more. The semiconductor switches used in energy conversion in photovoltaic (... » read more

Production Testing Of Discrete Power Products


By Vineet Pancholi and Dennis Dinawanao Metal Oxide Silicon Field Effect Transistors (MOSFETs), Insulated Gate Bipolar Transistors (IGBTs), Bipolar Junction Transistors (BJTs), diodes, and application specific multi-transistor packaged modules are some of the more popular discrete products. Switches control the flow of current within a circuit. MOSFETs are a building block of most electronic... » read more

Equipment Suppliers Brace For GaN Market Explosion


A huge GaN market is opening up, driven by consumer devices and the need for greater energy efficiency across many applications. Suppliers are ready, but to fully compete with SiC in high-voltage automotive applications will require further technological developments in power GaN (gallium nitride). Still, the 2020s mark a very high-growth phase for GaN markets. Revenues in the power GaN mark... » read more

Compound Semiconductor Innovation Advances EVs And Other Green Technologies


As the world works to reduce greenhouse gas emissions, global adoption of electric vehicles (EVs) is driving an increased demand for high-power, energy-efficient compound semiconductors, such as silicon carbide (SiC)-based components, throughout the entire EV assembly process. Renewable energy technology is now at the forefront of climate-forward research, with accelerating EV sales playing�... » read more

Parasitic Characterization Comes To Power Design Simulation


Two power design challenges are taking teams into unfamiliar territory. Wide bandgap (WBG) semiconductors target greater efficiency and density. Stricter EMI compliance regulations now come standard in mission-critical industries. Power design practices are still catching up. Simulation often takes a back seat to respinning hardware prototypes until success. What’s missing that could make sim... » read more

Silicon-based Power Semis Face Challenges


Suppliers of power semiconductors continue to develop and ship devices based on traditional silicon technology, but silicon is nearing its limits and faces increased competition from technologies like GaN and SiC. In response, the industry is finding ways to extend traditional silicon-based power devices. Chipmakers are eking out more performance and prolonging the technology, at least in th... » read more

China Accelerates Foundry, Power Semi Efforts


China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

Gearing Up For Next-Gen Power Semis


After years in R&D, several vendors are moving closer to shipping power semiconductors and other products based on next-generation wide-bandgap technologies. These devices leverage the properties of new materials, such as aluminum nitride, diamond, and gallium oxide, and they are also utilized in different structures, such as vertical gallium-nitride power devices. But while many of thes... » read more

Will An Adhesion Promoter Prevent Delamination In Power Semiconductor Packages?


Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is essential. As more semiconductor pack... » read more

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