Chip Industry Week In Review

By The SE Staff - 28 Mar, 2025 - Comments: 0

McKinsey issued a new report on the state of the chemical supply chain for semiconductors in the U.S., citing potential shortages of high-purity materials such as tungsten, aluminum and copper, lack of access to CMP slurries and photoresists for EUV, and rising competition for high-k precursors that can fetch higher prices outside of the U.S. CSIS weighed in on the U.S. goverment's recent ... » read more

Chip Failures: Prevention And Responses Over Time

By Ed Sperling - 19 Mar, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the causes of chip failures, how to respond to them, and how that can change over time, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verification scientist at Siemens EDA; and Jerome Toublanc, hi... » read more

What’s Changing In Outlier Detection

By Ed Sperling - 12 Mar, 2025 - Comments: 0

Commonly used outlier detection approaches, such as parts average testing or determining whether a die is good based upon other dies in the immediate neighborhood, are falling short in advanced packages and SoCs. Some devices may pass tests and still fail in the field. In the past, this was solved by adding margin into designs, but that margin now takes too big a bite out of performance and pow... » read more

Cutting IC Manufacturing Costs By Combining Data

By Anne Meixner - 11 Mar, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the benefits of incorporating financial data into fab floor decision-making, including what kind of cost data is most useful, with Dieter Rathei, CEO of DR Yield; Jon Holt, senior director of product management at PDF Solutions, Alex Burlak, vice president of advanced analytics and test at proteanTecs; and Dirk de Vries, techni... » read more

Failure To Launch

By Gregory Haley - 11 Mar, 2025 - Comments: 1

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power delivery architectures. All of these developments make defects harder to find and more expensive to fix, which impacts the reliability of chips and systems. Traditional failure analysis techniqu... » read more

Chip Industry Week In Review

By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Silent Data Errors Still Slipping Through The Cracks

By Laura Peters - 11 Feb, 2025 - Comments: 0

Silent data corruption errors in large server farms have become a major concern of cloud users, hyperscalers, processor manufacturers and the test community. Silent data errors (also called silent data corruption errors) are hardware errors that occur when an incorrect computational result from a processor core goes undetected by the system. The data is silently corrupted because neither sof... » read more

Using Test And Metrology Data For Dynamic Process Control

By Gregory Haley - 14 Jan, 2025 - Comments: 0

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device characterization, and complex yield optimization strategies. These combinations are essential to improving performance and functionality, but they create some thorny issues for which there are no easy fixes. ... » read more

Cut Defects, Not Yield

By proteanTecs - 14 Jan, 2025 - Comments: 0

Many chipmakers face a difficult trade-off — improve quality without affecting yield. Traditional testing methods fail to navigate this challenge due to their limited visibility below the pass/fail limits, discarding perfectly good chips or letting small defects slip through to the field. The challenge is clear: manufacturers must achieve both quality and yield goals without sacrificing one f... » read more

Expanding The Horizon Of System Monitoring With The Arm SMCF

By Ziv Paz - 14 Jan, 2025 - Comments: 0

In an era where system complexity is scaling rapidly, real-time monitoring and predictive analytics play a pivotal role in maintaining lifetime performance and reliability. At proteanTecs, we are committed to enabling advanced diagnostics, predictive maintenance, and on-chip actionable visibility for today’s mission-critical systems, across high-performance industries. Our in-chip monitori... » read more

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tag: proteanTecs

Chip Industry Week In Review

Chip Failures: Prevention And Responses Over Time

What’s Changing In Outlier Detection

Cutting IC Manufacturing Costs By Combining Data

Failure To Launch

Chip Industry Week In Review

Silent Data Errors Still Slipping Through The Cracks

Using Test And Metrology Data For Dynamic Process Control

Cut Defects, Not Yield

Expanding The Horizon Of System Monitoring With The Arm SMCF

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