tag: proteanTecs

New Uses For Manufacturing Data
By Ed Sperling - 12 May, 2020 - Comments: 0

The semiconductor industry is becoming more reliant on data analytics to ensure that a chip will work as expected over its projected lifetime, but that data is frequently inconsistent or incomplete, and some of the most useful data is being hoarded by companies for competitive reasons. The volume of data is rising at each new process node, where there are simply more things to keep track of,... » read more

Sensing Automotive IC Failures
By Anne Meixner - 12 May, 2020 - Comments: 1

The sooner you detect a failure in any electronic system, the sooner you can act. Together, data analytics and on-chip sensors are poised to boost quality in auto chips and add a growing level of predictive maintenance for vehicles. The ballooning number of chips cars makes it difficult to reach 10 defective parts per billion for every IC that goes into a car.  And requiring that for a 15-y... » read more

Reliability Monitoring Of GUC 7nm High-Bandwidth Memory (HBM) Subsystem
By proteanTecs - 27 Apr, 2020 - Comments: 0

This white paper presents the use of proteanTecs’ Proteus for HBM subsystem reliability based on deep data analytics and enhanced visibility, overcoming the limitations of advanced heterogeneous packaging. It will describe the operation concept and provide results from a GUC 7nm HBM Controller ASIC. A typical CoWoS chip has hundreds of thousands of micro-bumps (u-bumps). 3-8 u-bumps are us... » read more

Lessons In Monitoring System Performance
By Tamar Naishlos - 07 Apr, 2020 - Comments: 0

At proteanTecs, we set out to revolutionize electronics with a breakthrough approach to address the challenges that come with scale: Deep Data monitoring of the health & performance of systems, from design to field. Knowledge and education are profoundly rooted in our core values. However, as the circumstances of COVID-19 unfold, we are following the guidelines of the World Health Organi... » read more

Degradation Monitoring
By proteanTecs - 09 Mar, 2020 - Comments: 0

This paper describes a reliability degradation modeling and monitoring method based on a combination of IC novel embedded circuits (Agents), and off-chip machine learning algorithms which infer the digital readouts of these circuits during test and operational lifetime. Together, they monitor the margin degradation of an IC, as well as other vital parameters of the IC and its environmental s... » read more

Blog Review: Feb. 12
By Ed Sperling - 12 Feb, 2020 - Comments: 0

Complexity is growing by process node, by end application, and in each design. The latest crop of blogs points to just how many dependencies and uncertainties exist today, and what the entire supply chain is doing about them. Mentor's Shivani Joshi digs into various types of constraints in PCBs. Cadence's Neelabh Singh examines the complexities of verifying a lane adapter state machine in... » read more

Logic Chip, Heal Thyself
By Susan Rambo And Ed Sperling - 11 Feb, 2020 - Comments: 0

If a single fault can kill a logic chip, that doesn’t bode well for longevity of complex multi-chip systems. Obsolescence in chips is not just an industry ploy to sell more chips. It is a fact of physics that chips don’t last more than a few years, especially if overheated, and hit with higher voltage than it can stand. The testing industry does a great job finding defects during manufac... » read more

Using Machine Learning To Gain Data Insights
By Alex Burlak - 11 Feb, 2020 - Comments: 0

Today’s consumers have little appetite for networks that go down, for electronic devices that fail, and for any kind of digital service that doesn’t deliver as promised every time. Reliability is no longer a nice-to-have. It's  a key feature. The continued scaling of advanced electronics and chip manufacturing technologies, however, makes reliability harder to achieve — even as expectati... » read more

More Data, More Problems In Automotive
By Anne Meixner - 11 Feb, 2020 - Comments: 0

The race toward increasing levels of autonomy is being hampered by competitive concerns over sharing data across the automotive supply chain. Pushing past the initial ADAS levels into full autonomy is expected to take more than a decade, but the infrastructure for those systems, and making sure all assisted and autonomous vehicles work with other vehicles, is under development today. Still, ... » read more

Making 3D Structures And Packages More Reliable
By Ed Sperling - 14 Jan, 2020 - Comments: 0

The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

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