How Chips Age


Andre Lange, group manager for quality and reliability at Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about circuit aging, whether current methods of predicting reliability are accurate for chips developed at advanced process nodes, and where additional research is needed. » read more

Extreme Quality Semiconductor Manufacturing, Part 1: Automotive


By Ben Tsai and Cathy Perry Sullivan Across the full range of semiconductor device types and design nodes, there is a drive to produce chips with significantly higher quality. Automotive, IoT and other industrial applications require chips that achieve very high reliability over a long period of time, and some of these chips must maintain reliable performance while operating in an environmen... » read more

How To Ensure Reliability


Michael Schuldenfrei, corporate technology fellow at OptimalPlus, talks about how to measure quality, why it’s essential to understand all of the possible variables in the testing process, and why outliers are no longer considered sufficient to ensure reliability. » read more

Changes In Data Storage and Usage


Doug Elder, vice president and general manager of OptimalPlus, talks about what’s changing in the storage and collection, including using data lakes and data engineering to break down silos and get data into a consistent format, and why it’s essential to define data up front based upon how quickly it needs to be accessed, as well as who actually owns the data. » read more

How Hardware Can Bias AI Data


Clean data is essential to good results in AI and machine learning, but data can become biased and less accurate at multiple stages in its lifetime—from moment it is generated all the way through to when it is processed—and it can happen in ways that are not always obvious and often difficult to discern. Blatant data corruption produces erroneous results that are relatively easy to ident... » read more

IP’s Growing Impact On Yield And Reliability


Chipmakers are finding it increasingly difficult to achieve first-pass silicon with design IP sourced internally and from different IP providers, and especially with configurable IP. Utilizing poorly qualified IP and waiting for issues to appear during the design-to-verification phase just before tape-out can pose high risks for design houses and foundries alike in terms of cost and time to... » read more

Who Is Responsible For Part Average Testing?


With ever-increasing demands in the automotive industry, more and more semiconductor companies are interested in monitoring and improving quality and reliability. Outlier detection and more specifically Part Average Testing (PAT) is the industry standard for the automotive industry. But, who is responsible for quality? Historically, OSATs are responsible for this. In the past, once they... » read more

ATE Lab To Fab


Shu Li, business development manager at Advantest, zeroes in on the communication gap between engineers on the design side and the manufacturing/test side, why it exists, and what needs to be done to bridge that gap in order to speed up and improve test quality. https://youtu.be/Nd-5_twbJBw     See other tech talk videos here » read more

Hidden Soldier Joints Inspection: 4 Case Studies


IC packaging technologies are becoming smaller and thinner. Ball grid array (BGA) packages were introduced some years ago in order to save space on the PCB, and are now widely used. To overcome the resulting problems with using optical microscopy as an inspection tool, the endoscope found its way into quality engineering departments. To read more, click here. » read more

The 3 Main Obstacles To Zero DPPM And How To Overcome Them


As we all well know, there are multiple mission critical applications in today’s “Age of Smart” that are calling for zero DPPM (defective parts per million) in semiconductors and electronic systems. In industries such as automotive, medical, aerospace, and more, where lives are at stake, defective parts are not an option. The quality imperative However, with the ever-growing complexi... » read more

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