Online Template Attacks

By Rambus - 08 Jan, 2020 - Comments: 0

Authors: Lejla Batina, Radboud University Nijmegen, Nijmegen, The Netherlands Łukasz Chmielewski, Riscure, Delft, The Netherlands Louiza Papachristodoulou, Radboud University Nijmegen, Nijmegen, The Netherlands Peter Schwabe, Radboud University Nijmegen, Nijmegen, The Netherlands Michael Tunstall, Rambus Cryptography Research Division, San Francisco, USA. Template attacks are a special... » read more

Manufacturing Bits: Oct. 22

By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

Power/Performance Bits: Oct. 18

By Jesse Allen - 18 Oct, 2016 - Comments: 0

Speeding up memory with T-rays Scientists at the Moscow Institute of Physics and Technology (MIPT), the University of Regensburg in Germany, Radboud University Nijmegen in the Netherlands, and Moscow Technological University proposed a way to improve the performance of memory through using T-waves, or terahertz radiation, as a means of resetting memory cells. This process is several thousand... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Radboud University Nijmegen

Online Template Attacks

Manufacturing Bits: Oct. 22

Power/Performance Bits: Oct. 18