tag: Rambus

Data Center Scaling Requires New Interface Architectures
By Suresh Andani - 11 Jun, 2020 - Comments: 0

You can pick your favorite data points, but the bottom line is global data traffic is growing at an exponential rate driven by a confluence of megatrends. 5G networks are making possible billions of AI-powered IoT devices untethered from wired networks. Machine learning’s voracious appetite for enormous data sets is skyrocketing. Data intensive video streaming for both entertainment and busin... » read more

New Approaches For Dealing With Thermal Problems
By Ann Mutschler - 11 Jun, 2020 - Comments: 0

New thermal monitoring, simulation and analysis techniques are beginning to coalesce in chips developed at leading-edge nodes and in advanced packages in order to keep those devices running at optimal temperatures. This is particularly important in applications such as AI, automotive, data centers and 5G. Heat can kill a chip, but it also can cause more subtle effects such as premature aging... » read more

Fundamental Changes In Economics Of Chip Security
By Ed Sperling - 10 Jun, 2020 - Comments: 0

Protecting chips from cyberattacks is becoming more difficult, more expensive and much more resource-intensive, but it also is becoming increasingly necessary as some of those chips end up in mission-critical servers and in safety-critical applications such as automotive. Security has been on the semiconductor industry's radar for at least the past several years, despite spotty progress and ... » read more

Scaling Anti-Tamper Protection To Meet Escalating Threats
By Scott Best - 04 Jun, 2020 - Comments: 0

Anti-tamper tends to be one of those catchall phrases encompassing any countermeasure on a security chip. A more precise definition would be that anti-tamper protection is any collection of countermeasures that serves to thwart an adversary’s attempt to monitor or affect the correct operation of a chip or a security core within a chip. Given that, it can be useful to think about a hierarchy o... » read more

What Makes A Chip Tamper-Proof?
By Bryon Moyer - 04 Jun, 2020 - Comments: 5

The cyber world is the next major battlefield, and attackers are busily looking for ways to disrupt critical infrastructure. There is widespread proof this is happening. “Twenty-six percent of the U.S. power grid was found to be hosting Trojans," said Haydn Povey, IAR Systems' general manager of embedded security solutions. "In a cyber-warfare situation, that's the first thing that would b... » read more

Blog Review: June 3
By Jesse Allen - 03 Jun, 2020 - Comments: 0

Cadence's Paul McLellan takes a look at how Ethernet came to dominate wired networking and is now taking on automotive to provide the bandwidth necessary for the increasing number of sensors in modern vehicles. Mentor's Colin Walls notes the difficulty of assessing the quality of software, some key areas to pay attention to when assessing quality or trying to write quality code, and the bottom... » read more

Hardware Security For AI Accelerators
By Rambus - 03 Jun, 2020 - Comments: 0

Dedicated accelerator hardware for artificial intelligence and machine learning (AI/ML) algorithms are increasingly prevalent in data centers and endpoint devices. These accelerators handle valuable data and models, and face a growing threat landscape putting AI/ML assets at risk. Using fundamental cryptographic security techniques performed by a hardware root of trust can safeguard these as... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 May, 2020 - Comments: 0

Tools & IP Synopsys released a range of IP for TSMC's 5nm process technology. It includes interface PHY IP such as 112G/56G Ethernet, Die-to-Die, PCIe 5.0, CXL, and CCIX; memory interface IP for DDR5, LPDDR5, and HBM2/2E; die-to-die PHYs for 112G USR/XSR connectivity and High-Bandwidth Interconnect; and foundation IP including logic libraries, multi-port memory compilers, and TCAMs. Sma... » read more

Enabling Chiplet And Co-Packaged Optics Architectures With 112G XSR SerDes
By Suresh Andani - 14 May, 2020 - Comments: 0

Conventional chip designs are struggling to achieve the scalability, as well as power, performance, and area (PPA), that are demanded of leading-edge designs. With the slowing of Moore’s Law, high complexity ASICs increasingly bump up against reticle limits. The demise of Dennard scaling means power consumption is a growing challenge. In this context, disaggregated architectures such as chipl... » read more

‘More Than Moore’ Reality Check
By Ann Mutschler - 14 May, 2020 - Comments: 1

The semiconductor industry is embracing multi-die packages as feature scaling hits the limits of physics, but how to get there with the least amount of pain and at the lowest cost is a work in progress. Gaps remain in tooling and methodologies, interconnect standards are still being developed, and there are so many implementations of packaging that the number of choices is often overwhelming. ... » read more

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