Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)


A new technical paper titled "Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding" was published by researchers at Tohoku University. Abstract "Three-dimensional integrated circuit (3D-IC) technology, often referred to as through-silicon via (TSV) formation technology, has been steadily maturing and is increasingly used in advanced semic... » read more

Introduction To The NI mmWave Transceiver System Hardware


Wireless technology is everywhere. Every day more and more new wireless devices are being created and accessing today’s wireless networks, consuming more and more data. The number of new wireless devices continues to escalate and the amount of data consumed continues to grow at an exponential rate. In order to address the demand, new wireless technologies are being investigated to evolve the ... » read more

The Week In Review: Design


Tools Cadence unveiled two new tools. The first is a rapid prototyping platform that the company claims will shorten bring-up time by 70%, with 4X improvements in capacity, with IEEE 1801 support for low-power verification through its emulation platform. The second is a single and multi-corner custom/analog extraction tool, which it claims will improve performance by 5X. The tool has been cert... » read more