Cryogenic Etch Re-Emerges


After years in R&D, a technology called cryogenic etch is re-emerging as a possible option for production as the industry faces new challenges in memory and logic. Cryogenic etch removes materials in devices with high aspect ratios at cold temperatures, although it has always been a challenging process. Cryogenic etch is difficult to control and it requires specialized cryogenic gases in... » read more

Leti’s Next Focus


Emmanuel Sabonnadière, chief executive of Leti, sat down with Semiconductor Engineering to discuss R&D trends, a new deal with Soitec, and the latest developments at the France-based research organization. Leti is a research institute of CEA Tech. What follows are excerpts of that conversation. SE: Leti recently formed an alliance with Soitec. Under the terms, Leti and Soitec are formin... » read more

What’s Next In R&D?


Luc Van den hove, president and chief executive of Imec, sat down with Semiconductor Engineering to discuss R&D challenges and what’s next in the arena. The Belgium R&D organization is working on AI, DNA storage, EUV, semiconductors and other technologies. What follows are excerpts of that conversation. SE: Moore’s Law is slowing down. And it is becoming more expensive to move fr... » read more

Europe’s New R&D Program


European Union (EU) research, development and innovation programs have proved successful in recent decades. The current framework program (FP) Horizon 2020, with its 80 billion EUR total budget – around 17 billion EUR of which is allocated for Industrial Leadership – has produced unparalleled collaboration opportunities that no single European country can match on its own. FPs are strate... » read more

SEMI Members Mobilize For 2017 SEMI Washington Forum


SEMI hosted 24 industry executives in Washington, DC on March 28 & 29 to take part in the annual SEMI Washington Forum. The Washington Forum, which is supported by SEMI’s North American Advisory Board (NAAB), gives SEMI member company executives a chance to come to the Nation’s capital for a firsthand experience in engaging policymakers on the issues that are pertinent to the industry. ... » read more

Joint R&D Has Its Ups And Downs


As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

Changing Economics In Chip Manufacturing


The foundry and equipment businesses are poised for significant changes that could affect the balance of power far beyond just the semiconductor manufacturing sector. It’s no secret that the number of companies developing new chips at 7nm is shrinking. There will be even fewer at 5nm. The business case for moving forward is that density must provide a competitive edge. But that density imp... » read more

Executive Insight: Jack Harding


[getperson id="11145" comment="Jack Harding"], president and CEO of [getentity id="22242" e_name="eSilicon"], sat down with Semiconductor Engineering to talk about consolidation, business relationships, what it will take to survive in the IoT age, and how to better optimize chips. What follows are excerpts of that conversation. SE: We’ve been looking at consolidation for a while and all th... » read more

Successful FlexTech Integration Providing New Opportunities for SEMI Members


By Michael Ciesinski, President, FlexTech In 2014, SEMI developed a new model – SEMI Strategic Association Partnership – for engaging other associations and organizations in a strategic, long-term relationship that supports and advances the interests of SEMI members in emerging and adjacent segments of the electronics supply chain. The strategic partner brings a community, brand, and pro... » read more

Inside The OSAT Business


Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan's Advanced Semiconductor Engineering (ASE), the world's largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What is your overall outlook for 2016? Wu: Last year, the semi... » read more

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