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2.5/3D IC Reliability Verification Has Come A Long Way


2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a passive silicon interposer. The interposer is placed on a ball grid array (BGA) organic substrate. Micro-bumps attach each die to the interposer, and flip-chip (C4) bumps attach the interposer to the ... » read more

Challenges In RF Design


Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

ESD P2P And CD Verification Doesn’t Have To Be Hard


As a designer or verification engineer, you’re fighting the effects of electrostatic discharge (ESD) in your integrated circuit (IC) designs all the time. ESD is one of those frustrating issues that can challenge even the most experienced designers. Once an IC is in the market, unexpected electrical shorts will cause immediate failure or dielectric breakdown will result in gradual circuit deg... » read more