Artificial intelligence deep learning for 3D IC reliability prediction


New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

Challenges For Achieving Automotive Grade 1/0 Reliability In FCBGA and fcCSP Packages


As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive Electronics Council (AEC) Q-100 specification for Grade 1 and 0 reliability introduces unique challenges as thermal cycling (TC) and high temperature storage (HTS) requirements increase. Additional... » read more

Big Changes In Materials And Processes For IC Manufacturing


Rama Puligadda, CTO at Brewer Science, sat down with Semiconductor Engineering to talk about a broad set of changes in semiconductor manufacturing, packaging, and materials, and how that will affect reliability, processes, and equipment across the supply chain. SE: What role do sacrificial materials play in semiconductor manufacturing, and how is that changing at new process nodes? Puliga... » read more

Driving Toward A Sustainable Future


While the automotive industry has been focused on developing innovative electric vehicle (EV) designs for years, there is a new sense of urgency today. Worldwide sales of EVs are increasing quickly1, growing by 46% in 2020 and by 160% in the first half of 2021. Consumer demand is an important factor, but equally important are government mandates. In 2021, the European Union introduced strict... » read more

Silicon Lifecycle Management’s Growing Impact On IC Reliability


Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management, how it's expanding and changing, and where the problems are, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University; a... » read more

Mitigating Electronics Reliability Concerns During The Global Parts Shortage Crisis


The global parts shortage crisis has led to major disruptions to OEMs in the automotive, consumer electronics, and healthcare industries. To maintain production, many companies have been forced to rely on brokers to source the required parts, generating uncertainty in the quality of parts received. Additionally, some companies have had no choice but to replace previously used components with al... » read more

Robots Become More Useful In Factories


Most people associate factory automation with large robotic machines, such as those that weld automobile chassis on assembly lines. But as prices drop and technology improves, robots are being deployed for smaller and more varied tasks, and they are getting better at all of them. Inside of factories, robots can significantly improve output, consistency, and reliability. They can work around ... » read more

Auto Chipmakers Dig Down To 10ppb


How do engineers deliver 10 defective parts per billion (Dppb) to auto makers if they only screen 1 million parts per year? Answer: By comprehending failure mechanisms and proactively screening for them. Modern automobiles contain nearly 1,000 ICs that must perform over the vehicle’s life (15 years). This drives quality expectations ever higher. While 10 Dppm used to be a solid benchmark, ... » read more

HBM, Nanosheet FETs Drive X-ray Fab Use


Paul Ryan, vice president and general manager of Bruker’s X-ray Business, sat down with Semiconductor Engineering to discuss the movement of x-ray metrology into manufacturing to better control nanosheet film stacks and solder bump quality. SE: Where are you seeing the greatest growth right now, and what are the critical drivers for your technology from the application side? Ryan: One b... » read more

Assuring Reliable Processor Performance At Scale


In today’s data center environment, resilience is key. Cloud providers are built on as-a-service business models, where uptime is critical to ensure their customers’ business continuity. Reputation and competitiveness require service at extremely high performance, low power, and increasing functionality, with zero tolerance for unplanned downtime or errors. If you’re a hyperscaler, o... » read more

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