Blog Review: Dec. 20


Siemens' Huw Geddes finds that the flexibility offered by the RISC-V ISA can introduce further verification and validation requirements to ensure that the combination of extensions and customization not just works but does not break anything else while delivering expected performance, plus looks at how processor trace can help. Cadence's Gustavo Araujo explains the various optimizations in t... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Synopsys acquired Imperas, pushing further into the RISC-V world with Imperas' virtual platform technology for verifying and emulating processors. Synopsys has been building up its RISC-V portfolio, starting with ARC-V processor IP and a full suite of tools introduced last month. The first high-NA EUV R&D center in the U.S. will be built at... » read more

Blog Review: December 13


Synopsys' Charles Dittmer discusses key and emerging use cases for Bluetooth Low Energy and how combining BLE with other wireless protocols can open new avenues of functionality for application areas including automotive, hearables, and retail. Cadence's Neelabh Singh points out changes in the terminologies describing USB4 links and shows the various possible link configurations put forth by... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Auto Network Speeds Rise As Carmakers Prep For Autonomy


In-vehicle networks are starting to migrate from domain architectures to zonal architectures, an approach that will simplify and speed up communication in a vehicle using fewer protocols, less wiring, and ultimately lower cost. Zonal architectures will partition vehicles into zones that are more manageable and flexible, but getting there will take time. There is so much legacy technology in ... » read more

AI Races To The Edge


AI is becoming increasingly sophisticated and pervasive at the edge, pushing into new application areas and even taking on some of the algorithm training that has been done almost exclusively in large data centers using massive sets of data. There are several key changes behind this shift. The first involves new chip architectures that are focused on processing, moving, and storing data more... » read more

Semiconductor Device Manufacturing Process Challenges And Opportunities


Semiconductor device manufacturing involves a complex series of processes that transform raw materials into finished devices. The process typically involves four major stages: wafer fabrication, wafer testing, assembly or packaging, and final testing. Each stage has its own unique set of challenges and opportunities. The semiconductor device manufacturing process faces several challenges, inclu... » read more

Blog Review: Dec. 6


Cadence's Vinod Khera checks out potential implications of generative AI for EDA, including how it could increase the learning rate of students and reduce the rising verification cost. Synopsys' Kiran Vittal considers the driving factors behind RISC-V's growth and why it is becoming increasingly important for applications ranging from automotive to 5G mobile, AI, and data centers. Siemens... » read more

Simplifying the Connected Future: Navigating Complexity In The IoT Landscape


Smart home devices, appliances, ear buds, personal medical devices, smart energy meters, POS machines, asset, and fitness trackers, … Whatever device you can think of that makes our lives more convenient, safer and more enjoyable, in today’s world it’s likely to be connected, often wirelessly. Almost everywhere, connectivity is no longer an extra, it’s expected. And expectations are gro... » read more

Chip Industry Week In Review


By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

← Older posts Newer posts →