tag: RF

GaN-on-Si Technology Powers The Future Of Wireless
By Infineon - 09 Jul, 2025 - Comments: 0

Mobile data traffic continues to grow. Constant video streaming is on the rise in applications like TikTok, Netflix, and Instagram, while emerging AI-enhanced mobile apps are set to further boost data consumption by offering highly personalized experiences and advanced features like augmented reality and voice processing in real-time. Ericsson estimates that mobile data traffic, excluding fixed... » read more

Democratizing Design: How The CHIPS Act Is Reshaping EDA And Semiconductor Innovation
By Nilesh Kamdar - 02 Jul, 2025 - Comments: 0

After 26 years in the electronics industry, I've witnessed countless technological shifts, but few have been as transformative — or as promising — as what we're experiencing with the CHIPS Act. I spoke at a recent 62nd DAC panel discussion alongside industry colleagues Saverio Fazzari from Booz Allen Hamilton and Vivek Prasad from a non-profit organization established to operate the Nationa... » read more

Research Bits: June 17
By Jesse Allen - 17 Jun, 2025 - Comments: 0

Superlattice castellated FETs Researchers from the University of Bristol and Northrop Grumman Mission Systems discovered a latch-effect in gallium nitride (GaN) that could lead to improved radio frequency device performance, crucial for enabling 6G devices. “We have piloted a device technology, working with collaborators, called superlattice castellated field effect transistors (SLCFETs),... » read more

A New RF Platform For Silicon MMIC And System Design
By Cadence - 04 Jun, 2025 - Comments: 0

Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost. Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable se... » read more

Automotive Security Risks Associated With Wireless Communication
By Technical Paper Link - 01 May, 2025 - Comments: 0

A new technical paper titled "Revisiting Wireless Cyberattacks on Vehicles" was published by researchers at Comillas Pontifical University and MIT. Abstract "The automotive industry has been a prime target for cybercriminals for decades, with attacks becoming more sophisticated as vehicles integrate advanced digital technologies. In response, new standards and regulations have been introduc... » read more

Research Bits: Mar. 4
By Jesse Allen - 04 Mar, 2025 - Comments: 0

Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

Aging, Complexity, And AI In Analog Design
By Ed Sperling - 27 Nov, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss abstraction in analog vs. digital, how analog circuits age, the growing role of AI, and why there is so much margin in analog designs, with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal pro... » read more

Advanced Packaging Driving New Collaboration Across Supply Chain
By Gregory Haley - 24 Oct, 2024 - Comments: 0

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the convergence of heterogeneous integration, chiplets, and 3D stacking. Heterogeneous approaches allow companies to combine different te... » read more

Boost High-Performance IC Design Flows With Early Interactive Symmetry Checking
By Sara Khalaf - 17 Oct, 2024 - Comments: 0

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and RF designs. Achieving symmetry early in the design process helps to ensure consistent electrical behavior, which is essential for meeting performance goals and maintaining device reliability. H... » read more

Method To Determine The Permittivity of Dielectric Materials in 3D Integrated Structures At Broadband RF Frequencies
By Technical Paper Link - 25 Sep, 2024 - Comments: 0

A new technical paper titled "Characterizing the Broadband RF Permittivity of 3D-Integrated Layers in a Glass Wafer Stack from 100 MHz to 30 GHz" was published by researchers at NIST. Abstract "We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave ele... » read more

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