Power/Performance Bits: Dec. 3


Waking up IoT devices Researchers at UC San Diego developed an ultra-low power wake-up receiver chip that aims to reduce the power consumption of sensors, wearables, and Internet of Things devices that only need to communicate information periodically. "The problem now is that these devices do not know exactly when to synchronize with the network, so they periodically wake up to do this eve... » read more

Manufacturing Bits: Nov. 19


World’s lightest foam Lawrence Livermore National Laboratory (LLNL) has developed what researchers say is the world’s lightest gold foam. LLNL has devised gold aerogel foam. The foam is light enough where it could be carried on the back of tiny insects. Applications for the technology include electronics, catalysis, sensors and energy conversion and storage. An aerogel is based on a ... » read more

Manufacturing Bits: Oct. 9


World’s strongest silver A group has developed what researchers say is the world’s strongest silver. The silver demonstrated a hardness of 3.05 GPa, which is 42% stronger than the previous world record. The University of Vermont, Lawrence Livermore National Lab, the Ames Laboratory, Los Alamos National Laboratory and UCLA contributed to the work. Silver is an element with high electr... » read more

Power/Performance Bits: July 3


2D straintronics Researchers at the University of Rochester and Xi’an Jiaotong University dug into how 2D materials behave when stretched to push the boundaries of what they can do. "We're opening up a new direction of study," says Stephen Wu, assistant professor of electrical and computer engineering and physics at Rochester. "There's a huge number of 2D materials with different properti... » read more

Power/Performance Bits: June 25


Improving IGBTs Researchers at the University of Tokyo developed a power switching device that surpasses previous performance limits, showing that there may still be gains ahead for the silicon-based devices, which have been thought to be approaching their limits. The team's improved insulated gate bipolar transistor (IGBT) used a scaling approach, and simulations showed that downscaling pa... » read more

Power/Performance Bits: June 4


Flexible high-temp dielectric Researchers at Rice University, Georgia Institute of Technology, and Cornell University developed a new high-temperature dielectric nanocomposite for flexible electronics, energy storage, and electric devices that combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The polymer nanofibers act as a structural reinforcement, w... » read more

System Bits: April 16


Characterizing 2D borophene Researchers at Rice and Northwestern universities collaborated on a method to view the polymorphs of 2D borophene crystals, providing insights into the lattice configurations of the two-dimensional material. Boris Yakobson, a materials physicist at Rice’s Brown School of Engineering, and materials scientist Mark Hersam of Northwestern led a team that not only d... » read more

Manufacturing Bits: Feb. 26


Vitamin C chips Using vitamin C, Rice University has developed a process that turns gold nanorods into small gold nanowires. Nanorods are a type of structure, while nanowires are simply tiny wires. With the technology, Rice is able to produce nanowires with various lengths. These can be used in electronics as well as light-manipulating applications like plasmons. A “plasmon is a quantum o... » read more

System Bits: Feb. 26


Firefly microstructures in LED light bulbs Pennsylvania State University researchers wanted to improve the energy efficiency of commercial light-emitting diode light bulbs to save even more energy. They found the answer in the lantern surface of fireflies. "LED lightbulbs play a key role in clean energy," said Stuart (Shizhuo) Yin, professor of electrical engineering at Penn State. "Overall... » read more

System Bits: Jan. 22


Toward more trusted microelectronics David Crandall, an associate professor in Indiana University Bloomington’s School of Informatics, Computing and Engineering, is collaborating with other researchers through the Indiana Innovation Institute (IN3) to work on technology challenges for private industry and the U.S. Department of Defense. Crandall is currently tackling trusted microelectron... » read more

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