tag: RISC-V

Lightweight, High-Performance CPU Extension for Protected Key Handles with CPU-Enforced Usage (CISPA, Ruhr Univ. Bochum)
By Technical Paper Link - 09 Oct, 2024 - Comments: 0

A new technical paper titled "KeyVisor -- A Lightweight ISA Extension for Protected Key Handles with CPU-enforced Usage Policies" was published by researchers at CISPA Helmholtz Center for Information Security and Ruhr University Bochum. Abstract "The confidentiality of cryptographic keys is essential for the security of protection schemes used for communication, file encryption, and outsou... » read more

Corner-Case Bug Hunting for RISC-V
By Ashish Darbari - 30 Sep, 2024 - Comments: 0

By Ashish Darbari and Ia Tsomaia RISC-V continues to make headlines worldwide, but verification continues to be challenging. The findings of the Wilson Research Report, 2022 (see figure 1) make the trends in verification clear. We presented these in a keynote talk titled, "Future is Formal," at the recent DVCon India event. One thing is quite apparent: whether you are using directed tests... » read more

Flexible IGZO RISC-V Microprocessor
By Technical Paper Link - 26 Sep, 2024 - Comments: 0

A new technical paper titled "Bendable non-silicon RISC-V microprocessor" was published by researchers at Pragmatic Semiconductor, Qamcom,  and Harvard University. From the abstract: "Here we present Flex-RV, a 32-bit microprocessor based on an open RISC-V instruction set fabricated with indium gallium zinc oxide thin-film transistors on a flexible polyimide substrate, enabling an ultralow... » read more

What Comes After HBM For Chiplets
By Brian Bailey - 18 Sep, 2024 - Comments: 0

Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja... » read more

Hardware-Side-Channel Leakage Contracts That Account For Glitches and Transitions (TU Graz)
By Technical Paper Link - 10 Sep, 2024 - Comments: 0

A new technical paper titled "Closing the Gap: Leakage Contracts for Processors with Transitions and Glitches" was published by researchers at Graz University of Technology. Abstract "Security verification of masked software implementations of cryptographic algorithms must account for microarchitectural side-effects of CPUs. Leakage contracts were proposed to provide a formal separation bet... » read more

Edge Devices Require New Security Approaches
By Adam Kovac - 29 Aug, 2024 - Comments: 0

The diversity of connected devices and chips at the edge — the vaguely defined middle ground between the end point and the cloud — is significantly widening the potential attack surface and creating more opportunities for cyberattacks. The edge build-out has been underway for at least the past half-decade, largely driven by an explosion in data and increasing demands to process that data... » read more

Chip Industry Week In Review
By The SE Staff - 16 Aug, 2024 - Comments: 0

The U.S. Department of Commerce and Texas Instruments (TI) signed a non-binding preliminary memorandum of terms to provide up to $1.6 billion in CHIPS Act funding towards TI’s investment of over $18 billion for three 300mm semiconductor wafer fabs under construction in Texas and Utah. TI also expects to get about $6 billion to $8 billion from the U.S. Department of Treasury’s Investmen... » read more

CHERI RISC-V: HW Extension for Conditional Capabilities
By Technical Paper Link - 28 Jul, 2024 - Comments: 0

A technical paper titled “Mon CHÈRI <3 Adapting Capability Hardware Enhanced RISC with Conditional Capabilities” was published by researchers at Ericsson Security Research, Université Libre de Bruxelles, and KU Leuven. Abstract: "Up to 10% of memory-safety vulnerabilities in languages like C and C++ stem from uninitialized variables. This work addresses the prevalence and lack of ade... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

The Value Of Innovation
By Brian Bailey - 27 Jun, 2024 - Comments: 1

This week's Design Automation Conference is all about the new things that are going on in the industry, both challenges and opportunities. By this time this blog goes live, I will have moderated a panel about why EDA has not been open to disruption. While preparing for that, a number of thoughts emerged in my mind. First, we have to remember that EDA is a business whose role is to support th... » read more

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