Adding Security Into Test

By Ed Sperling - 04 Apr, 2023 - Comments: 0

Security is becoming a much bigger concern as more electronics are added into cars, as more devices are connected to the internet, and as the value of data continues to increase. The problem is that security is dynamic. It continues to change throughout the lifetime of a system, and some of these devices are expected to last for a decade or more. Lee Harrison, director of Tessent product market... » read more

Hidden Impacts Of Software Updates

By Ed Sperling - 10 May, 2022 - Comments: 0

Over-the-air updates can reduce obsolescence over longer chip and system lifetimes, but those updates also can impact reliability, performance, and affect how various resources such as memory and various processing elements are used. The connected world is very familiar with over-the-air (OTA) updates in smart phones and computers, where the software stack — firmware, operating systems, dr... » read more

Big Changes Ahead For Inside Auto Cabins

By Bryon Moyer - 08 Dec, 2021 - Comments: 0

The space we occupy inside our vehicles is poised to change from mere enclosure to participant in the driving experience. Whether for safety or for comfort, a wide range of sensors are likely to appear that will monitor the “contents” of the vehicle. The overall approach is referred to as an in-cabin monitoring system (ICMS), but the specific applications vary widely. “In-cabin sensing... » read more

Auto Displays: Bigger, Brighter, More Numerous

By Ann Mutschler - 05 Aug, 2021 - Comments: 0

Displays are rapidly becoming more critical to the central brains in automobiles, accelerating the adoption and evolution of this technology to handle multiple types of audio, visual, and other data traffic coming into and flowing throughout the vehicle. These changes are having a broad impact on the entire design-through-manufacturing flow for display chip architectures. In the past, these ... » read more

MEMS: New Materials, Markets And Packaging

By Ed Sperling - 28 Jul, 2021 - Comments: 1

Semiconductor Engineering sat down to talk about future developments and challenges for microelectromechanical systems (MEMS) with Gerold Schropfer, director of MEMS products and European operations in Lam Research's Computational Products group, and Michelle Bourke, senior director of strategic marketing for Lam's Customer Support Business Group. What follows are excerpts of that conversation.... » read more

Automated Traceability Of Requirements In The Design And Verification Process Of Safety-Critical Mixed-Signal Systems

By Fraunhofer IIS/EAS - 07 Apr, 2021 - Comments: 0

System-level design and verification of safety-critical hardware requires a consistent methodology which complies with industrial safety-standards, for example ISO 26262 for automotive applications. For certification of safety-critical systems, the development process has to implement and enforce a strict traceability of requirements, linking the requirement specification, the design implementa... » read more

Big Changes In Verification

By Ann Mutschler - 28 Jan, 2021 - Comments: 0

Verification is undergoing fundamental change as chips become increasingly complex, heterogeneous, and integrated into larger systems. Tools, methodologies, and the mindset of verification engineers themselves are all shifting to adapt to these new designs, although with so many moving pieces this isn't always so easy to comprehend. Ferreting out bugs in a design now requires a multi-faceted... » read more

Analog Fault Simulation

By Ed Sperling - 30 May, 2019 - Comments: 0

Anand Thiruvengadam, senior staff product marketing manager at Synopsys, drills down into the need for fault simulation in analog circuits in automotive designs. » read more

Safety-Critical Coverage

By Ed Sperling - 24 Apr, 2019 - Comments: 0

Dave Landoll, solutions architect at OneSpin Solutions, discusses verification in safety-critical designs, why it’s more of a challenge in automotive than in avionics, and why verification of these systems includes what the system should not be doing as well as what it should be doing. https://youtu.be/Ze3WwEARfx0 » read more

The Long And Detailed Road To Automotive Compliance

By Ann Mutschler - 04 Apr, 2019 - Comments: 0

Compliance with automotive safety requirements is slowing down both innovation and participation by a flurry of startups as the whole ecosystem struggles to bring autonomous vehicles to reality. This is particularly onerous for chipmakers, which face a high bar for IC integrity and reliability. They must meet specifications and be free of design errors. Improper behavior in corner-case s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?