Do More, Earlier

By Jason Andrews - 29 Sep, 2016 - Comments: 0

The ARM Cortex-R52 processor is the most advanced processor for functional safety and the first implementation of the ARMv8-R architecture. Along with the announcement of the Cortex-R52, ARM offers a number of development tools to help partners speed up their path to market. This is especially helpful for a new architecture which highlights software separation for safety and security. This arti... » read more

Mixed-signal/Low-power Design

By Jeff Dorsch - 26 Jul, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss mixed-signal/low-power IC design with Phil Matthews, director of engineering at Silicon Labs; Yanning Lu, director of analog IC design at Ambiq Micro; Krishna Balachandran, director of low power solutions marketing at [getentity id="22032" comment="Cadence"]; Geoffrey Ying, director of product marketing, AMS Group, [getentity id="22035" e_name="Syno... » read more

The Hardest Part Of DO-254 Is…

By Louie De Luna - 26 May, 2016 - Comments: 0

The hardest part of DO-254 is not the requirements. It’s not the design. It’s not the verification. We just wrapped up this year’s 3-day DO-254 Practitioner’s Course, and each year I learn something new. In this year’s training we had attendees from major aerospace companies including Curtiss Wright, Rolls Royce, Sierra Nevada Corporation, Thales and Woodward. It’s always a pleas... » read more

Tech Talk: ADAS

By Ed Sperling - 23 Mar, 2016 - Comments: 0

Kurt Shuler, vice president of marketing at Arteris, explains what the Advanced Driver Assistance Systems standard is, where the problems are, and why this is becoming so important in automotive semiconductor design. » read more

IP Risk Sharing

By Brian Bailey - 10 Mar, 2016 - Comments: 0

For most people within the semiconductor industry, managing risk involves making the right product decisions that will enable a company to be profitable, and ensuring the product is successfully produced within the necessary time window. In contrast, for products within high-risk areas such as medical and mil/aero, design often proceeds at a slower pace, using proven technologies and adopting l... » read more

Designing For Automotive

By Ann Mutschler - 15 Jan, 2015 - Comments: 0

As cars include an increasing amount of electronics and electronics subsystems, the number of design challenges involving reliability, cost and power are on the rise. “Reliability tops the list of concerns for the design team because when you put these electronics in, you must know if they are going to operate efficiently by themselves," said Aveek Sarkar, vice president of product enginee... » read more

Malaysia Airlines Flight MH370 And The Progress of Technology

By Kurt Shuler - 31 Mar, 2014 - Comments: 1

Cable news has been continuously deluging us with lots of speculation regarding the fate of Malaysia Airlines flight 370. Most of us are drowning in a sea of jargon as TV talking heads express incredulity that, “with all our modern technology, a plane disappeared…” Although the disappearance of flight MH370 is a terrible tragedy, I see the larger context of our progress in commercial a... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: safety

Do More, Earlier

Mixed-signal/Low-power Design

The Hardest Part Of DO-254 Is…

Tech Talk: ADAS

IP Risk Sharing

Designing For Automotive

Malaysia Airlines Flight MH370 And The Progress of Technology

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Knowledge Centers
Entities, people and technologies explored