Manufacturing Bits: Nov. 25

By Mark LaPedus - 25 Nov, 2020 - Comments: 0

Lidar-on-a-chip At the upcoming IEEE International Electron Devices Meeting (IEDM), Samsung will present a paper on the industry’s first single-chip lidar beam scanner. (Go to this link and then look for paper 7.2, “Single-Chip Beam Scanner with Integrated Light Source for Real-Time Light Detection and Ranging,” J. Lee et al, Samsung.) Lidar, or light imaging, detection, and ranging, ... » read more

EUV Challenges And Unknowns At 3nm and Below

By Mark LaPedus - 19 Nov, 2020 - Comments: 1

The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

Designs Beyond The Reticle Limit

By Brian Bailey - 12 Nov, 2020 - Comments: 0

Designs continue to grow in size and complexity, but today they are reaching both physical and economic challenges. These challenges are causing a reversal of the integration trend that has provided much of the performance and power gains over the past couple of decades. The industry, far from giving up, is exploring new ways to enable designs to go beyond the reticle size, which is around 8... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 30 Oct, 2020 - Comments: 0

Trade and government The U.S. continues to tighten its export controls for hi-tech, including a move to restrict fab technologies that enable 5nm chip production. The U.S. Department of Commerce has imposed controls on six more technologies, bringing the total to 37. They include: hybrid additive manufacturing/computer controlled tools; computational lithography software designed for EUV masks... » read more

Regaining The Edge In U.S. Chip Manufacturing

By Mark LaPedus & Ann Steffora Mutschler - 26 Oct, 2020 - Comments: 16

The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

What’s Ahead For Chips & Equipment?

By Mark LaPedus - 22 Oct, 2020 - Comments: 0

It’s been a topsy-turvy year in the semiconductor industry. 2020 was supposed to be a strong year. Then, the coronavirus outbreak hit. Countries implemented various measures to mitigate the outbreak, such as stay-at-home orders and store closures. Economic turmoil and job losses soon followed. Earlier in the year, the chip market looked bleak. Now, business appears to be strong. To gain... » read more

Manufacturing Bits: Oct. 12

By Mark LaPedus - 12 Oct, 2020 - Comments: 1

MoSi2 pellicles for EUV Hanyang University has presented a paper that describes a novel molybdenum disilicide (MoSi2) pellicle membrane for use in extreme ultraviolet (EUV) lithography. With a 28nm thickness, a MoSi2 membrane has demonstrated a 89.33% transmittance for EUV lithography. The pellicle technology is still in R&D. MoSi2, which is a silicide of molybdenum, is a refractory cer... » read more

DRAM, 3D NAND Face New Challenges

By Mark LaPedus - 21 Sep, 2020 - Comments: 1

It’s been a topsy-turvy period for the memory market, and it's not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In addition, the 3D NAND market is moving toward a new technology generation, but some are enc... » read more

Industry Pushes For Fab Tool Security Standards

By Mark LaPedus - 17 Sep, 2020 - Comments: 1

The semiconductor industry is developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP theft. Two new standards are in the works, which are being formulated under the auspices of the SEMI trade group with leadership from chipmakers and others. Led by Intel and Cimetrix, the first standard deals with malware-free equ... » read more

Momentum Builds For Advanced Packaging

By Mark LaPedus - 17 Sep, 2020 - Comments: 0

The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce p... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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