The Week In Review: Manufacturing


Market research Intel retained its No. 1 position as the largest semiconductor manufacturer and grew its semiconductor revenue 4.6% in 2016, according to Gartner. Samsung Electronics continued to maintain the No. 2 spot with 11.7% market share. The largest mover in the top 25 was Broadcom, which moved up 12 places in the market share ranking, according to the firm. Worldwide silicon wafer a... » read more

High-Stakes Litho Game


The commercial introduction of EUV looks all but assured these days. There is enough history to show it works. Uptime and throughput are improving, and systems are shipping today. The question now is how to measure its success. In the short-term, this is a fairly simple financial exercise for companies like ASML and Zeiss, which have been closely collaborating to get these massive systems ou... » read more

Notes From The Chip Beat


Over the last several months, I’ve attended a number of conferences, such as IEDM, SPIE, the FD-SOI Summit and others. At each conference, there is a dizzying amount of information and data. Eventually, some information turns into an article, while most ends up buried in a reporter’s notebook. In any case, here are five observations I’ve made, based on those and other events in the pa... » read more

200mm Crisis?


Over the last year or so, the IC industry has experienced an acute shortage of both 200mm fab capacity and 200mm equipment amid a surge of demand for certain chips. Right now, though, the 200mm shortfall is much worse than before. But this situation isn’t expected to improve for both elements in the second half of 2017, and perhaps beyond. On the capacity front, chipmakers are generally... » read more

North America Equipment Market Rebounds


Coming off of two consecutive down years, the North America semiconductor fab equipment market is set to experience growth this year and into 2018. The market is primarily being driven by investments from Samsung, Intel, GlobalFoundries, and Micron, which are expected to account for 85 percent of fab equipment purchased in the region this year. These fab equipment purchases are targeted ... » read more

Blog Review: May 17


Synopsys' Robert Vamosi digs into last Friday's massive ransomware infection that impacted the UK health system, a Spanish telecom, and many other organizations running unpatched Windows – and whether there's a second version out there. Cadence's Paul McLellan reports on the latest developments and future of FD-SOI from the SOI Silicon Valley Symposium. Mentor's Joe Hupcey III chats wit... » read more

Moore’s Law: Toward SW-Defined Hardware


Pushing to the next process node will continue to be a primary driver for some chips—CPUs, FPGAs and some ASICS—but for many applications that approach is becoming less relevant as a metric for progress. Behind this change is a transition from using customized software with generic hardware, to a mix of specialized, heterogeneous hardware that can achieve better performance with less ene... » read more

The Week In Review: Manufacturing


Market research Intel held a slim 4% lead over Samsung for the number one position in terms of chip sales in the first quarter, according to IC Insights. But as reported, Samsung is on pace to displace Intel as the world’s largest semiconductor supplier in the second quarter, according to the firm. Meanwhile, in the ranking, SK Hynix and Micron made the biggest moves. And there was one new e... » read more

The Week In Review: Manufacturing


Fab tools, test and packaging Brewer Science has sold its so-called Cee semiconductor processing equipment business. A former employee, Russ Pagel, has formed a new company, Cost Effective Equipment, to take over ownership and operate the Cee business. The new company, which will remain in Rolla, Mo., will sell spin coaters, bake plates, bonders and other systems. Taiwan’s Ministry of E... » read more

22nm Process War Begins


Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

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