tag: Samsung

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design
By David Vye - 15 Dec, 2016 - Comments: 0

The integration of simulation technologies, system prototyping tools, and automated test equipment is critical for addressing the complexity of developing 5G wireless technology. In these cases, design teams will need to rely on a combination of simulation and prototype testing in order to ensure design robustness. Although simulation is essential to design a test bed or prototype, measurement... » read more

Fab Tool Biz Faces Challenges In 2017
By Mark LaPedus - 15 Dec, 2016 - Comments: 3

After experiencing a gradual recovery and positive growth in 2016, the semiconductor equipment industry sees a mixed picture as well as some uncertainty in 2017. In the near term, though, business is robust. Several chipmakers started to place a sizeable number of fab tool orders in the latter part of 2016, particularly in three areas—3D NAND, logic and foundry. Now, after buying the in... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Dec, 2016 - Comments: 2

Chipmakers At this week’s IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC as well as the team of GlobalFoundries, IBM and Samsung separately presented papers on 7nm finFET technology. Qualcomm has begun sampling the world’s first 10nm server processor. As the first in the Qualcomm Centriq product family, the ARM-based processor has up to 48-cores and is built ... » read more

Manufacturing Bits: Dec. 6
By Mark LaPedus - 06 Dec, 2016 - Comments: 1

The National High Magnetic Field Laboratory (MagLab) has broken an unofficial record for the world’s most powerful hybrid magnet. The 33-ton system, called the series connected hybrid (SCH) magnet, has reached its full field strength of 36 tesla. The SCH is more than 40% stronger than the previous world-record hybrid magnet. Tesla, or T, is the measurement of magnetic field strength. A ref... » read more

360 Video Gains Ground
By Freddi Jeffries - 05 Dec, 2016 - Comments: 0

360 degree video is changing not only the way we consume content, but the way we create it. We’re no longer restricted to sharing our experiences in selfies, single photos or even panoramas to capture more of a given scene. With 360 degree video we can now share the whole scene, and not just in static images, but in motion. Better still, gone are the days of retrospective slideshows of your f... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Dec, 2016 - Comments: 0

Manufacturing There are more changes at SEMI. SEMI has named David Anderson as president of the SEMI Americas region. Most recently, Anderson was chief executive and chairman of Novati, a specialty manufacturing fab. He replaces Karen Savala, who was president of the SEMI Americas region for six years. In an e-mail, Savala confirmed she left SEMI in October. Meanwhile, in October, SEMI an... » read more

Harder Than It Looks
By Ed Sperling - 01 Dec, 2016 - Comments: 0

First Apple scales back plans to develop its own vehicle. Then Intel creates its own automotive chip unit. This kind of two-step movement in the automotive electronics industry is becoming more common. NXP buys Freescale, then Qualcomm buys NXP. Harman buys Symphony Teleca and Red Bend Software, then Samsung buys Harman. All of these moves are proof points that innovation and fleet-foo... » read more

Multi-Patterning Issues At 7nm, 5nm
By Ed Sperling - 28 Nov, 2016 - Comments: 13

Continuing to rely on 193nm immersion lithography with multiple patterning is becoming much more difficult at 7nm and 5nm. With the help of various resolution enhancement techniques, optical lithography using a deep ultraviolet excimer laser has been the workhorse patterning technology in the fab since the early 1980s. It is so closely tied with the continuation of [getkc id="74" comment="Mo... » read more

Where Is The New Competition?
By Ed Sperling - 22 Nov, 2016 - Comments: 0

Consolidation is a regular topic of discussion at semiconductor industry conferences and trade shows. Anyone who has been to these gatherings over the past couple decades can see there are fewer companies presenting and exhibiting, fewer startups taking the place of those that were bought, and a dramatic increase in one-day, one-vendor-sponsored events where top experts are gathered to talk abo... » read more

New Wave Of Consolidation
By Ed Sperling - 22 Nov, 2016 - Comments: 0

Consolidation is picking up again across the semiconductor industry, against a backdrop of looming interest rate hikes, geopolitical uncertainty, and the erosion of longstanding demarcations between markets. In the past couple of weeks, Siemens signed a deal to buy [getentity id="22017" e_name="Mentor Graphics"] for $4 billion, and [getentity id="22865" e_name="Samsung"] purchased Harman, a ... » read more

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