tag: Samsung

New BEOL/MOL Breakthroughs?
By Mark LaPedus - 15 Jun, 2017 - Comments: 1

Chipmakers are moving ahead with transistor scaling at advanced nodes, but it's becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which represent a larger portion of the cost and unwanted resistance in chips at the most advanced nodes. A leading-edge chip consists of three parts—the transistor, contacts and interconnects. The ... » read more

Inside FD-SOI And Scaling
By Mark LaPedus - 15 Jun, 2017 - Comments: 5

Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], sat down with Semiconductor Engineering to discuss FD-SOI, IC scaling, process technology and other topics. What follows are excerpts of that conversation. SE: In logic, GlobalFoundries is shipping 14nm finFETs with 7nm in the works. The company is also readying 22nm FD-SOI technology with 12nm FD-SOI ... » read more

Modeling On-Chip Variation At 10/7nm
By Ann Mutschler - 14 Jun, 2017 - Comments: 1

Simulation, a workhorse tool for semiconductor design, is running out of steam at 10/7nm. It is falling behind on chips with huge gate counts and an enormous number of possible interactions between all the different functions that are being crammed onto a die. At simulation's root is some form of SPICE, which has served as its underpinnings ever since SPICE was first published 44 years ago. ... » read more

2.5D, ASICs Extend to 7nm
By Mark LaPedus - 13 Jun, 2017 - Comments: 2

The leading-edge foundry market is heating up. For example, GlobalFoundries, Intel, Samsung and TSMC have recently announced their new and respective processes. The new processes from vendors range anywhere from 10nm to 4nm, although the current battle is taking place at 10nm and/or 7nm. In fact, one vendor, GlobalFoundries, this week will describe more details about its previously-announced... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Jun, 2017 - Comments: 0

Market research Earlier this year, the IC and equipment markets were projected to be flat. More recently, though, analysts have raised their forecast, including Pacific Crest Securities. “We are raising our 2017 capex outlook meaningfully, with the upside coming predominantly from Samsung,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. "We're raising our 2017 se... » read more

Age Of Acceleration
By Ed Sperling - 08 Jun, 2017 - Comments: 0

A shift from the fastest processors to accelerating specific functions is underway, supplanting an era of dark silicon in which one or more processor cores remain in a ready state whenever a single core's performance bogs down. In effect, the dark silicon/multi-core approach is being scrapped for many functions in favor of an accelerator-based microarchitecture that is far more granular. The... » read more

Fab Spending Hits New High
By Christian Dieseldorff - 07 Jun, 2017 - Comments: 0

The latest update to the World Fab Forecast report, published on May 31, 2017 by SEMI, reveals record spending for fab construction and fab equipment. Korea, Taiwan, and China all see large investments, and spending in Europe has also increased significantly. In 2017, over US$49 billion will be spent on equipment alone, a historic record for the semiconductor industry. Spending on new fab cons... » read more

System Bits: June 6
By Ann Mutschler - 06 Jun, 2017 - Comments: 0

Silicon nanosheet-based builds 5nm transistor To enable the manufacturing of 5nm chips, IBM, GLOBALFOUNDRIES, Samsung, and equipment suppliers have developed what they say is an industry-first process to build 5nm silicon nanosheet transistors. This development comes less than two years since developing a 7nm test node chip with 20 billion transistors. Now, they’ve paved the way for 30 billi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Jun, 2017 - Comments: 0

Market research IC Insights has released its capital spending forecast by company. In total, there are 15 companies that are forecast to have semiconductor capital expenditures of $1.0 billion or more in 2017, up from 11 in 2016, according to IC Insights. Four companies—Intel, Samsung, GlobalFoundries, and SK Hynix—are expected to represent the bulk of the increase in spending, accord... » read more

IoT Security Challenges, Opportunities
By Jeff Dorsch - 01 Jun, 2017 - Comments: 0

The specter of cybersecurity is haunting the Internet of Things—or more specifically, the lack of it. Big companies in information technology and telecommunications have embraced the [getkc id="76" kc_name="IoT"] as a significant business opportunity, and the field is inspiring hundreds of startups in Silicon Valley and elsewhere. Venture capitalists hungrily eye the IoT, betting on which ... » read more

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