tag: Self-assembly

Research Bits: Dec. 3
By Jesse Allen - 03 Dec, 2024 - Comments: 0

Self-assembly of mixed-metal oxide arrays Researchers from North Carolina State University and Iowa State University demonstrated a technique for self-assembling electronic devices. The proof-of-concept work was used to create diodes and transistors with high yield and could be used for more complex electronic devices. “Our self-assembling approach is significantly faster and less expensi... » read more

Nanosized Blocks Self-Assemble In Water To Create Tiny Floating Checkerboards (UC San Diego, Duke)
By Technical Paper Link - 26 Jun, 2024 - Comments: 0

A technical paper titled “Self-assembly of nanocrystal checkerboard patterns via non-specific interactions” was published by researchers at the University of California San Diego and Duke University. Abstract: "Checkerboard lattices—where the resulting structure is open, porous, and highly symmetric—are difficult to create by self-assembly. Synthetic systems that adopt such structures... » read more

Devices And Transistors For The Next 75 Years
By Laura Peters - 16 Feb, 2023 - Comments: 0

The 75th anniversary of the invention of the transistor sparked a lively panel discussion at IEDM, spurring debate about the future of CMOS, the role of III-V and 2D materials in future transistors, and what will be the next great memory architecture.[1] Industry veterans from the memory, logic, and research communities see high-NA EUV production, NAND flash with 1,000 layers, and hybrid bon... » read more

Revealing the Effect of Nanoscopic Design on the Charge Carrier Separation Processes in Semiconductor-Metal Nanoparticle Gel Networks
By Technical Paper Link - 22 Dec, 2021 - Comments: 0

Abstract: "In this paper, it is shown that the nanoscopic design of combining semiconductors and noble metals has a direct impact on the macroscopic (electrochemical) properties of their assembled, hyperbranched, macroscopic gel networks. Controlled and arbitrary deposition of gold domains on CdSe/CdS nanorods leads to tipped and randomly decorated heteroparticles, respectively. Structur... » read more

Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE
By Technical Paper Link - 27 Aug, 2021 - Comments: 0

T. Fukushima, "Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE," 2021 Symposium on VLSI Circuits, 2021, pp. 1-2, doi: 10.23919/VLSICircuits52068.2021.9492335. Abstract: "More recently, "chiplets" are expected for further scaling the performance of LSI systems. However, system integration with the chiplets is not a new methodology. The basic concept dates back well over ... » read more

Power/Performance Bits: June 5
By Jesse Allen - 05 Jun, 2018 - Comments: 0

Self-assembled battery Researchers at Cornell University developed a self-assembling battery capable of near-instant charging. Instead of having the batteries' anode and cathode on either side of a nonconducting separator, the team's new approach intertwines the components in a self-assembling, 3D gyroidal structure, with thousands of nanoscale pores filled with the elements necessary for e... » read more

Will Directed Self-Assembly Pattern 14nm DRAM?
By Mattan Kamon - 17 Mar, 2016 - Comments: 1

Will directed self-assembly (DSA) join Extreme Ultraviolet (EUV) Lithography and next-generation multi-patterning techniques to pattern the next memory and logic technologies? Appealing to the wisdom of crowds, the organizers of the 2015 1st International DSA symposium recently surveyed the attendees. Nearly 75% believed DSA would insert into high-volume manufacturing within the next 5 years... » read more

Manufacturing Bits: March 10
By Mark LaPedus - 10 Mar, 2015 - Comments: 0

Hi-tech pens The University of California at San Diego has developed a hi-tech ballpoint pen. Researchers have taken off-the-shelf ballpoint pens and filled them with bio inks. With so-called enzymatic-ink-based roller pens, users are able to draw biocatalytic sensors on a surface. [caption id="attachment_18297" align="alignleft" width="300"] Researchers draw sensors capable of detecting... » read more

Beyond Moore’s Law
By Michael Watts - 15 May, 2014 - Comments: 0

What do you make of all the different reports coming out of Advanced Lithography 2014 — the end of Moore's Law, continued problems with EUV, directed self-assembly assembly makes progress? An equipment insider, whose judgment I value, came back from the meeting and concluded, "We will see the end of Moore’s Law shrinks in 2020. After that, no one knows!” There is no way a $300B+ business ... » read more

Manufacturing Bits: April 15
By Mark LaPedus - 15 Apr, 2014 - Comments: 0

Self-assembled nano-walls Using a self-assembly process, Texas A&M University and the International Institute for Carbon-Neutral Energy Research have devised a new technology called “nano-walls.” [caption id="attachment_11488" align="alignnone" width="499"] Researchers use common spray gun to create self-assembling nanoparticle films. (Source: Texas A&M).[/caption] Researcher... » read more

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