tag: SEMI

Chip Industry Week In Review
By The SE Staff - 08 Sep, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according to SEMI. Similarly, the top 10 semiconductor foundries reported a 1.1% quarterly-over-quarter revenue decline in Q2. A rebound is anticipated in Q3, according to TrendForce. Synopsys extended its AI-driven EDA ... » read more

Blog Review: September 6
By Jesse Allen - 06 Sep, 2023 - Comments: 0

Cadence's Reela Samuel listens in as industry experts discuss whether generative AI-powered tools could facilitate the creation of diverse chip types and address talent shortages by creating  a more accessible entry point for those interested in circuit, chip, or system design. Synopsys' Ian Land, Jigesh Patel, and Kenneth Larsen find that the way that today’s government, aerospace, and d... » read more

Blog Review: August 30
By Jesse Allen - 30 Aug, 2023 - Comments: 0

Siemens' Dan Yu examines hallucinations in large language models, the Universal Approximation Theorem, and the role they play in applying LLMs to EDA. Cadence's Mamta Rana introduces shared flow control in PCIe 6.0, which enables the reduced cost implementation of multiple virtual channels by allowing common sets of resources to be shared. Synopsys' Arturo Salz and Johannes Stahl note tha... » read more

Blog Review: Aug. 23
By Jesse Allen - 23 Aug, 2023 - Comments: 0

Siemens' Stephen Chavez discusses best practices when it comes to thermal analysis for PCB design, including component placement and close collaboration between mechanical and electrical engineering disciplines. Synopsys' Gary Ruggles, Richard Solomon, and Varun Agrawal introduce the Compute Express Link (CXL) specification and how it could help improve latency through computational offloadi... » read more

Securing Chip Manufacturing Against Growing Cyber Threats
By Anne Meixner - 17 Aug, 2023 - Comments: 0

Semiconductor manufacturers are wrestling with how to secure a highly specialized and diverse global supply chain, particularly as the value of their IP and their dependence upon software increases — along with the sophistication and resources of the attackers. Where methodologies and standards do exist for security, they often are confusing, cumbersome, and incomplete. There are plenty of... » read more

FLEX 2023 Takeaways: Flexible And Printed Electronics Move Into Electronics Manufacturing
By Gity Samadi - 17 Aug, 2023 - Comments: 0

By Gity Samadi and Paul Semenza The FLEX Conference, held again this year in conjunction with SEMICON West 2023, provided numerous examples of continued developments in flexible, printed, and flexible hybrid electronics technologies applied to sensing, robotics, communications, and other applications. At the same time, there is growing focus on applying various additive manufacturing equipme... » read more

Blog Review: Aug. 16
By Jesse Allen - 16 Aug, 2023 - Comments: 0

Synopsys' Johannes Stahl and Tim Kogel suggest that multi-die systems require a new approach at the architecture planning phase and why chip designers can’t ignore physical effects such as layout, power, temperature, or IR-drop. Siemens' Rich Edelman argues for using the waveform window in a GUI rather than $display when debugging UVM. Cadence's Paul Scannell stresses the need for diver... » read more

Blog Review: Aug. 2
By Jesse Allen - 02 Aug, 2023 - Comments: 0

Siemens' Katie Tormala points to the need for die attach thermal testing to ensure efficient removal of heat dissipation from power electronics components to prevent premature failure or thermal runaway. Synopsys's Dermott Lynch notes that over 30% of semiconductor failures are attributed to electrostatic discharge, with damage ranging from leakages and shorts to junction and metallization b... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 28 Jul, 2023 - Comments: 0

The Chinese government is considering easing proposed rules that require foreign office equipment makers operating in the country to transfer key product technology to China, per Nikkei Asia. In April 2022, Chinese authorities began revamping their national standards to include a new requirement that key components, such as semiconductors and laser-related items, be designed, developed, and pro... » read more

Blog Review: July 26
By Jesse Allen - 26 Jul, 2023 - Comments: 0

Siemens' Chris Spear shows how to make a group of specialized classes in SystemVerilog. Synopsys' Guy Cortez and Randy Fish consider what a silicon lifecycle management strategy looks like for SoCs deployed in HPC and data center environments. Cadence's Veena Parthan provides a primer on writing Python scripts for Fidelity, including API descriptions and different sets of packages to acce... » read more

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