tag: SEMI

Blog Review: April 12
By Jesse Allen - 12 Apr, 2023 - Comments: 0

Cadence's Ericles Sousa describes the five critical features of automotive SoC architectures that are essential for developing the next generation of passenger vehicles. In a podcast, Siemens' Steph Chavez chats with Gerry Partida of Summit Interconnect about the difficulties in collaboration between PCB designers and manufacturers, along with best practices that designers should follow to r... » read more

Blog Review: April 5
By Jesse Allen - 05 Apr, 2023 - Comments: 0

Synopsys's Gordon Cooper argues that AI transformer models, initially developed for natural language processing such as translation and question answering, are starting to make inroads in the computer vision application landscape and changing the direction of deep-learning architectures. Siemens' Patrick Hope shows how to identify opportunities to optimize a PCB design through the creation o... » read more

Week In Review: Design, Low Power
By Susan Rambo - 31 Mar, 2023 - Comments: 0

Synopsys rolled out an AI-driven design suite called Synopsys.ai at the Synopsys User Group conference this week, which it says reduces time to better results at multiple points in the design flow. The company noted the new technology uses reinforcement learning, which compensates for relatively small data sets by allowing engineers to interact with that data more easily at any point, and to ch... » read more

Blog Review: March 29
By Jesse Allen - 29 Mar, 2023 - Comments: 0

Siemens' Heather George suggests adopting a shift-left strategy for complex designs that integrate multiple dies into a package and examines the challenges and opportunities for performing comprehensive tests on 2.5D and 3D IC designs. Synopsys' Shekhar Kapoor notes that when considering whether a system will perform as intended, techniques that work well for monolithic SoCs may not be as we... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 24 Mar, 2023 - Comments: 0

TEL announced plans to build a ¥2.2 billion ($168.2 million) production and logistics center at its Tohoku Office to increase capacity. Construction of the 57,000m² facility, which will be used for manufacturing thermal processing and single-wafer deposition systems, is slated to start in spring 2024, and expected to be completed in fall 2025. Toshiba's board voted in favor of a 2 trillio... » read more

Blog Review: March 22
By Jesse Allen - 22 Mar, 2023 - Comments: 0

Siemens EDA's Dan Yu warns that the unavailability of verification data is slowing down the development of advanced machine learning for verification, with valuable data assets either siloed among different team members or projects or simply discarded due to the lack of analytic techniques to extract value from them. Synopsys' Richard Solomon and Dana Neustadter point to the need for hardwar... » read more

Unleashing the Potential of Compound Semiconductors: Industry Leaders Collaborate at SEMICON Taiwan 2022 to Create Ecosystem
By Ashley Huang - 16 Mar, 2023 - Comments: 0

Delivering high-speed processing over 100 times faster than silicon, compound semiconductors have made the devices a magnet for developers of leading-edge technologies out to maximize performance in key segments including automotive, data centers and communications. With the rising profile of compound semiconductors as the backdrop, leading experts gathered at the Power and Opto Semiconductor F... » read more

Blog Review: March 15
By Jesse Allen - 15 Mar, 2023 - Comments: 0

Siemens EDA's Dan Yu finds that high-quality, well-connected mass data are crucial to the success of applying machine learning to verification and recommends teams pivot to a data-centric workflow. Synopsys' Shankar Krishnamoorthy suggests that deploying AI-driven chip design and verification can free teams from iterative work, letting them focus instead on product differentiation and PPA en... » read more

Blog Review: March 8
By Jesse Allen - 08 Mar, 2023 - Comments: 0

Synopsys' Rahul Thukral and Bhavana Chaurasia find that embedded MRAM is undergoing an uplift in utilization for low-power, advanced-node SoCs thanks to its high capacity, high density, and ability to scale to lower geometries. Siemens EDA's Chris Spear dives into the UVM Factory with a look at the  SystemVerilog Object-Oriented Programming concepts behind the factory. Cadence's Veena Pa... » read more

Blog Review: March 1
By Jesse Allen - 01 Mar, 2023 - Comments: 0

Siemens EDA's Chris Spear explains the UVM Factory and how it can facilitate collaboration by enabling injection of new features without affecting your team. Cadence's Paul McLellan looks at efforts to ensure chiplets from different companies work together, particularly when the creating companies didn't pre-plan for those specific chiplets to work together, as well as the problems of failur... » read more

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