Chip Industry Week In Review

By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Developing Systems For Heterogeneous Integration: Insights From HiCONNECTS

By Kartikey Srivistava - 20 Feb, 2025 - Comments: 0

The European semiconductor ecosystem continues to evolve, driven by the ambitions outlined in the EU Chips Act. With goals to strengthen Europe’s technological leadership and double its semiconductor manufacturing market share to 20% by 2030, collaboration across the value chain is imperative. Heterogeneous Integration for Connectivity and Sustainability (HiCONNECTS), a Horizon Europe-funde... » read more

Blog Review: Feb. 19

By Jesse Allen - 19 Feb, 2025 - Comments: 0

Cadence's Ravi Vora explains the AMBA Local Translation Interface protocol, which defines the point-to-point protocol between an I/O device and the Translation Buffer Unit of an Arm System Memory Management Unit. Siemens' Stephen V. Chavez provides a checklist for ensuring the quality and functionality of a PCB at every stage, from design through fabrication, assembly, and testing, with a fo... » read more

Chip Industry Week In Review

By The SE Staff - 14 Feb, 2025 - Comments: 0

Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group. CSIS released a new report, “Critical Minerals and the Future of the U.S. Economy,” with detailed analysis and policy recommendations for building a secure mineral supply chain for semicond... » read more

IC Equipment Communication Standards Struggle As Data Volumes Grow

By Anne Meixner - 11 Feb, 2025 - Comments: 0

The tsunami of data produced during wafer fabrication cannot be effectively leveraged without standards. They determine how data is accessed from equipment, which users need data access and when, and how fast it can be delivered. On top of that, best practices in data governance and data quality are needed to effectively interpret collected data and transfer results. When fab automation and ... » read more

Blog Review: Feb. 5

By Jesse Allen - 05 Feb, 2025 - Comments: 0

Cadence's Rajneesh Chauhan explores the extended metadata feature in CXL 3.1, which helps systems manage memory and devices more effectively by sending extra information along with memory transactions to provide more context about what's happening during these transactions. Siemens' Bianca Ward recommends semiconductor companies combat rising production costs by leaning into digitalization a... » read more

Blog Review: Jan. 29

By Jesse Allen - 29 Jan, 2025 - Comments: 0

Cadence's Reela Samuel looks beyond silicon to new semiconductor materials under development and the particular applications for gallium nitride, silicon carbide, indium phosphide, glass, and diamond. Siemens' Kyle Fraunfelter and Melville Bryant find that lean approaches alone cannot address the increasingly complex sustainability challenges of semiconductor manufacturing and call for the e... » read more

MEMS And Imaging Drive The Sensor Revolution

By Ana Bernardo - 23 Jan, 2025 - Comments: 0

By Ana Bernardo and Sitong He As the world becomes increasingly interconnected, MEMS and imaging sensor technologies are driving transformative changes across industries, shaping the future of connectivity, intelligence, and sustainability. Powered by advances in miniaturization, AI integration, and sustainable design, MEMS and imaging technologies are enabling groundbreaking applications—... » read more

Blog Review: Jan. 22

By Jesse Allen - 22 Jan, 2025 - Comments: 0

Cadence's David Shin provides an overview of the eUSB2V2 specification, which scales up to 4.8Gbps of data rate and provides the flexibility to configure either asymmetrical or symmetrical links depending on the intended application. Siemens EDA's Spencer Acain highlights the key role of AI in semiconductor testing, including the addition of analytical AI in DFT tools and how applying machin... » read more

Chip Industry Week In Review

By The SE Staff - 17 Jan, 2025 - Comments: 0

GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced semiconductors and AI rolled out this week as U.S. President Biden wrapped up his term: The Biden-Harris Administration released an Interim Final Rule on Artificial Intelligence Diffusion to strengthen ... » read more

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tag: SEMI

Chip Industry Week In Review

Developing Systems For Heterogeneous Integration: Insights From HiCONNECTS

Blog Review: Feb. 19

Chip Industry Week In Review

IC Equipment Communication Standards Struggle As Data Volumes Grow

Blog Review: Feb. 5

Blog Review: Jan. 29

MEMS And Imaging Drive The Sensor Revolution

Blog Review: Jan. 22

Chip Industry Week In Review

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