Blog Review: May 4


In a podcast, Arm's Geof Wheelwright chats with Steve Furber of the University of Manchester and Christian Mayr of Technische Universität Dresden about spiking neural networks and the SpiNNaker project to build a platform for realistic real-time models of brain functions. Synopsys' Licinio Sousa checks out how the MIPI protocol enables the connectivity needed for sensor fusion and increasin... » read more

Chipping In For Equipment Suppliers: The Equipment Multiplier Effect On The Chip Shortage


By Ajit Manocha and Sanjay Malhotra Global semiconductor supply imbalances have hindered countless industries including essential segments such as automotive and medical as well as workers and consumers. Around the world, policymakers are increasing semiconductor manufacturing capacity to strengthen supply chains and meet growing demand for semiconductors through robust incentive packages to... » read more

Week In Review: Manufacturing, Test


It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Chip Industry Heads Toward $1T


The chip industry is on track to hit $1 trillion sometime over the next decade, and while the exact timing depends on a variety of factors, the trend line appears to be stable. The digitization of data, the digitalization of technology, and the expansion into new and existing markets, collectively are expected to drive chip industry growth for years to come. Exactly when the IC world will to... » read more

Blog Review: April 27


Siemens' Joseph Dailey and Jake Wiltgen dispel misunderstandings around safety qualification of software tools and point to some of the safety issues that could lead to schedule delays and additional costs. Synopsys' Mark Kahan explains the testing that went into creating parts of the James Webb Space Telescope and key questions that were asked to ensure the mission could be successful even ... » read more

Photomask Shortages Grow At Mature Nodes


A surge in demand for chips at mature nodes, coupled with aging photomask-making equipment at those geometries, are causing significant concern across the supply chain. These issues began to surface only recently, but they are particularly worrisome for photomasks, which are critical for chip production. Manufacturing capacity is especially tight for photomasks at 28nm and above, driving up ... » read more

Mask And Metrology Technology Trends


Aselta Nanographics of Grenoble, France, which produces software for wafer and mask patterning based on e-beam technology for IC manufacturing, along with advanced metrology solutions for scanning electron microscopes, recently became an ESD Alliance member. Adding to its impressive credentials, Aselta is a spin-off of CEA-Leti, the electronics and information technologies research institut... » read more

Blog Review: April 20


Cadence's Paul McLellan looks at the difference between 3D packaging and 3D integration and the different approaches to system-in-package designs. Siemens' Spencer Acain finds that despite having less precision and flexibility than digital chips, analog computing is having a resurgence in the space of cutting-edge AI thanks to the speed and energy efficiency in specialized tasks. Synopsys... » read more

Week In Review: Manufacturing, Test


Photonic Chips Go Big In Europe PhotonDelta, a collaborative end-to-end supply chain for the application of photonics chips, secured €1.1 billion in conditional funding for a six-year initiative. Investments from the Netherlands government and other organizations “will be used to build 200 startups, scale up production, create new applications for photonic chips, and develop infrastructure... » read more

Blog Review: April 13


Synopsys' Scott Durrant, Priyank Shukla, Mitch Heins, and Jigesh Patel provide a brief overview of the history of copper and optical interconnects used in data centers, the limitations of existing interconnect solutions, and the future of co-packaged optics. Siemens' Trey Reeser finds that it's not only necessary for semiconductor companies to address the safety and security of products for ... » read more

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