Blog Review: Sept. 16


Cadence's Paul McLellan checks out what's new for TSMC's advanced packaging solutions and the ultra-low power, RF, eNVM, and CMOS image sensor specialty processes. Mentor's Ron Press points to an automated solution to measuring pattern value that provides a consistent, “apples to apples” assessment of patterns detecting defects based on the likelihood the physical defects occurring. S... » read more

Week In Review: Manufacturing, Test


Top story NVIDIA and SoftBank Group Corp. (SBG) have announced a definitive agreement under which NVIDIA will acquire Arm from SBG and the SoftBank Vision Fund in a transaction valued at $40 billion. Market research Here’s the latest fab equipment forecast from VLSI Research: “The semiconductor equipment market has been very resilient in 2020 despite a very challenging macroeconomic ... » read more

Blog Review: Sept. 9


Mentor's Jacob Wiltgen considers the recent advances in safety critical engineering and how automated the lifecycle can become, where tools form a set of checks and balances to ensure the accuracy of results. Cadence's Paul McLellan finds out what's new at TSMC, including a new R&D center, fab construction, capacity increases for existing nodes, and what the company sees for beyond its N... » read more

New Data Format Boosts Test Analytics


Demand for more and better data for test is driving a major standards effort, paving the way for one of most significant changes in data formats in years. There is good reason for this shift. Data from device testing is becoming a critical element in test program decisions regarding limits and flows. This is true for everything from automotive and medical components to complex, heterogeneous... » read more

Blog Review: Sept. 2


Arm's Pranay Prabhat highlights research into zero-power or low-power sensing devices and work toward designing a microcontroller that could fit with DARPA N-ZERO sensors. Mentor's Shivani Joshi provides a primer on the ODB++ standard data exchange file format that generates PCB design data files for use in fabrication, assembly, and test. Cadence's Paul McLellan shares some highlights fr... » read more

Week In Review: Manufacturing, Test


Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

Blog Review: Aug. 26


Cadence's Paul McLellan shares some highlights from Hot Chips, including the massive growth in deep learning models, the basics of designing neural network models, and challenges involved in different approaches. Mentor's Colin Walls explores memory management units, its job of translating an address used by the CPU to an alternative address, and why this remapping is desirable and useful. ... » read more

Week In Review: Manufacturing, Test


Packaging Chunghwa Telecom, ASE and Qualcomm Technologies have announced plans to jointly build Taiwan's first 5G mmWave enterprise private network smart factory. As part of the plan, ASE is deploying a series of smart factory technologies within its existing Kaohsiung, Taiwan-based campus. This includes the deployment of 5G mmWave network cells in the Kaohsiung campus. Qualcomm will be ... » read more

Semiconductors Up Globally, Warnings Ahead


Things are picking up. Purchasing managers indices indicated July manufacturing increases in most key countries with only South Korea and Japan having PMIs still in contraction territory (chart 1). The Global PMI recovered sharply (chart 2), reaching 50.3 in July. Service sector still fighting pandemic The manufacturing sector is recovering but the service sector is still struggling, hit h... » read more

Blog Review: Aug. 19


Rambus' Scott Best digs into some of the most sophisticated attacks used to target and compromise security chips, such as laser voltage probing, focused ion beam editing, reverse engineering, and NVM extraction, and ways to counter them. Synopsys' Chris Clark proposes a way to identify problems earlier and better ensure safety and reliability in automotive SoCs by moving from a linear develo... » read more

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