Week In Review: Manufacturing, Test


Chipmakers TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, will utilize TSMC’s 5nm technology and will produce 20,000 wafers per month. TSMC’s total spending on this project will be approximately $12 billion from 2021 to 2029. Construction is planned to start in 2021 with production targeted to begin in 202... » read more

Blog Review: May 13


Mentor's Neil Johnson considers when in a project certain verification methods should be deployed and the relative impact of techniques at a given point in subsystem design. Cadence's Paul McLellan looks back at the development of mobile standards with 2G, GSM, and the transition to all-digital transmission. Synopsys' Taylor Armerding highlights five online courses to boost your software ... » read more

Week In Review: Manufacturing, Test


Chipmakers The Trump administration has held talks with Intel and TSMC to build more leading-edge fabs in the U.S., according to the Wall Street Journal and other news outlets. IC Insights has released its rankings of the top-10 chip vendors in terms of sales for the first quarter. Intel remains in first place, followed by Samsung and TSMC. The big surprise is China-based fabless IC supplie... » read more

Blog Review: May 6


In a blog for Arm, Javier Fernandez-Marques of Oxford University digs into how to make the best use of quantized neural network models and why it's so important to consider what algorithms will be running when deciding which model architecture to implement, and which quantization strategy to adopt for the model. Synopsys' Taylor Armerding explains why, with a largely remote workforce, it may... » read more

Key Drivers In New Chip Industry Outlook


How well the semiconductor industry fares over the next 12 to 24 months depends upon the evolution of a virus. That alone will determine the correct model for an economic rebound — V, U, extended U, or maybe even a double U. But what's also becoming clear is those models don't apply uniformly to all sectors or sub-sectors of the semiconductor industry. Looked at as a whole, the entire indu... » read more

Week In Review: Auto, Security, Pervasive Computing


Data center, 5G security Nvidia won approval for its Mellanox Technologies Ltd. deal from China, according to an article on Bloomberg. Mellanox chips split up and manage AI datasets for parallel processing, which can be used in data centers for computing. Rambus has released security for 800 Gigbit Ethernet MAC (media access control) for enhanced data center and 5G infrastructure. It secure... » read more

Blog Review: April 29


Arm's Paul Whatmough checks out SCALE-Sim, an open source cycle-accurate simulator specifically for neural processing unit (NPU) architectures. Mentor's Neil Johnson shows how a complete verification methodology requires complementary deployment of multiple techniques, with different options at each level of abstraction. Cadence's Paul McLellan checks out challenges in automotive reliabil... » read more

Week In Review: Manufacturing, Test


Chipmakers Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. There are already signs that the foundries have pushed out their 3nm production schedules. So, expect 7nm and 5nm to become long-running nodes. At 3nm, Samsung and TSMC are going in different directions. Samsung is developing a gate-all-around (GAA) technology called nanosheet FETs. TSMC will e... » read more

Week In Review: Auto, Security, Pervasive Computing


PCs get work-from-home bump Rather than using Intel chips, Apple will be making its own chips for its Mac computers, using Arm cores, Bloomberg reports. TSMC will manufacture the chips. Intel, meanwhile, was up 14% quarter year-over-year its PC business, which it attributes to more people working from home and needed new equipment. Despite a strong quarter, however, the company pulled its 2... » read more

Blog Review: April 22


Mentor's Shivani Joshi takes a look at the benefits of adding ground planes in PCB design to improve signal integrity and reduce electrical noise and interference. Cadence's Paul McLellan points to the gradual adoption of 3D packaged systems, the role of mobile in driving adoption, and the rise of chiplets. Synopsys' Taylor Armerding shares some tips for productive remote teamwork from th... » read more

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