Samsung Unveils Scaling, Packaging Roadmaps

By Ed Sperling - 24 May, 2017 - Comments: 5

Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

Will Higher Production Costs Hamper IoT Growth?

By Joanne Itow - 22 May, 2017 - Comments: 0

No question, 2017 is expected to be a good year for the semiconductor industry. Semiconductor revenues for 2017 are expected to increase more than 9% this year. A 6% increase in unit sales, as well as higher average selling prices for memory products, will help drive the revenue growth rate to its highest level since 2010. Wafer demand is forecast to grow by almost 8%. The higher revenue growth... » read more

Impact Of Rising SoC Design Costs On Innovation

By Rich Wawrzyniak - 20 Apr, 2017 - Comments: 0

If there is one truism in the semiconductor market, it is that rising costs will impact unit demand at some point if they continue long enough. The subject of this blog deals not with device ASPs; but rather with rising SoC design costs, and their effect on the number of designs at the advanced nodes. Even though the mechanism governing each set of numbers is different (device ASPs vs. design c... » read more

Blog Review: April 19

By Jesse Allen - 19 Apr, 2017 - Comments: 0

Mentor's Tom Fitzpatrick explains what the Portable Stimulus standard will do, what it won't, and why the choice of input language defined by the standard matters. Cadence's Paul McLellan listens in as IRDS chairman Paolo Gargini explains how long it takes technology breakthroughs to make out of the lab and into high-volume manufacturing. Synopsys' Robert Vamosi points to the recent sound... » read more

2017 Off To A Good Start, January Up 10.6% Year Over Year

By Jim Feldhan - 16 Mar, 2017 - Comments: 0

January 2017 semiconductor sales exceeded $29 billion, representing a 10.6% increase over January 2016 and a decline of 10% from December 2016. The average weekly industry ship rate for January was $7.3 billion. Extending this ship rate for the year would produce an annual revenue of $380 billion or 10% growth. Semico is forecasting a couple of slow months and some price degradation on a few ke... » read more

Semiconductor CapEx To Increase 4.3% In 2017

By Adrienne Downey - 20 Feb, 2017 - Comments: 0

Semiconductor capital expenditures are an important bellwether for the industry. Based on preliminary findings, Semico Research predicts 2017’s total will increase 4.3% to $69.7 billion, a record high, and a slightly larger increase than in 2016. Semico tracks more than 80 companies for CapEx and R&D spending, although many of those companies have merged, have been acquired, or gone ba... » read more

Work Remains To Enable Connected Cars, Automotive Security

By Ann Mutschler - 02 Feb, 2017 - Comments: 0

The automotive industry continues to chug along, evolving constantly with focus on a number of technology areas including ADAS applications, electric vehicles, infotainment, and security. And thankfully, there is still time left on the fully autonomous roadmap for these issues to get worked out. As part of this time of significant changes, the automotive OEMs are continuing to adjust as well... » read more

Power Management Vs. State Machines

By Rich Wawrzyniak - 23 Jan, 2017 - Comments: 0

In the last several years, contemporary SoCs (systems-on-a-chip) have become very complex silicon solutions. They now consist of hundreds of millions of gates, 100 or more discrete Semiconductor Intellectual Property (SIP) blocks, high-speed data channels, megabytes of volatile and non-volatile embedded memory, increasing amounts of analog/mixed signal functionality, multiple CPU cores and mult... » read more

Blog Review: Jan. 18

By Jesse Allen - 18 Jan, 2017 - Comments: 0

Mentor's Michael White warns that while skipping a node can be appealing, be prepared for the increase in computation requirements. Synopsys' Hezi Saar checks out the benefits of moving to the MIPI I3C standardized sensor interface. Cadence's Paul McLellan highlights a talk by Eric Grosse on approaches to security and the RISC-V architecture. Applied's Mike Chudzik explains the problem... » read more

Blog Review: Jan. 4

By Jesse Allen - 04 Jan, 2017 - Comments: 0

Mentor's Harry Foster wraps up his functional verification study series with a look the impact of verification maturity and safety critical designs on first silicon success. Synopsys' David Benas argues for using the insurance industry as a model in assessing the risk of potential software flaws. Cadence's Tom Anderson shares highlights from the recent International Workshop on Microproce... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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