Week In Review: Manufacturing, Test

By Mark LaPedus - 14 Dec, 2018 - Comments: 2

Intel Mark Bohr, a senior fellow and director of process architecture and integration at Intel, is retiring, according to the company. Bohr, who will retire at the end of February 2019, held various technology positions during his 41-year career at Intel. Here is a quick bio on Bohr. Others have also recently retired from Intel’s manufacturing unit amid a massive reorganization in the depart... » read more

Planarization Challenges At 7nm And Beyond

By Ed Sperling - 10 Dec, 2018 - Comments: 0

Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner. https://youtu.be/iNA6EGpoYZU _________________________________ See more tech talk videos here » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 07 Dec, 2018 - Comments: 0

Fab tools/manufacturing Lam Research has accepted Martin Anstice’s resignation as chief executive and a member of the board. Lam has named Tim Archer as president and chief executive effective immediately. Archer, who served as Lam’s president and chief operating officer, has been named to the board. One analyst provided a comment on the situation at Lam. “In our view, Mr. Archer is very... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 30 Nov, 2018 - Comments: 0

Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

Machine Learning Moves Into Fab And Mask Shop

By Mark LaPedus - 14 Nov, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

Using DSA With EUV

By Ed Sperling - 05 Nov, 2018 - Comments: 1

James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science, looks at how directed self-assembly can be used to supplement EUV at advanced nodes. https://youtu.be/PItF4egHOxc See other tech talk videos here » read more

Defect Reduction At 7/5nm

By Ed Sperling - 12 Jul, 2018 - Comments: 0

Darin Collins, director of metrology at Brewer Science, talks about the cause of defects at advanced nodes and how material purity increasingly plays a role in overall quality and yield. » read more

The Week In Review: Manufacturing

By Mark LaPedus - 08 Jun, 2018 - Comments: 0

Fab tools Applied Materials has launched a suite of products that will enable cobalt metallization schemes for contacts and interconnects in chips at advanced nodes. The products from Applied enable a complete cobalt fill process. The tools include CMP, CVD, PVD and RTP systems. At advanced nodes, cobalt promises to reduce unwanted resistance in the critical parts of a chip. Cobalt is bein... » read more

IIoT And Predictive Maintenance

By Jeff Dorsch - 30 May, 2018 - Comments: 1

It’s every production line manager’s nightmare—some machinery breaks down, stopping production on the factory floor. In a fab, if just one piece of semiconductor manufacturing equipment goes down and is out of service for hours, wafer fabrication can grind to a halt. Such shutdowns are expensive, especially if the plant is operating on a 24-hour schedule to meet demand. One selling poi... » read more

Variation Spreads At 10/7nm

By Ed Sperling - 16 Nov, 2017 - Comments: 6

Variation between different manufacturing equipment is becoming increasingly troublesome as chipmakers push to 10/7nm and beyond. Process variation is a well-known phenomenon at advanced nodes. But some of that is actually due to variations in equipment—sometimes the exact same model from the same vendor. Normally this would fall well below the radar of the semiconductor industry. But as t... » read more

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tag: semiconductor manufacturing

Week In Review: Manufacturing, Test

Planarization Challenges At 7nm And Beyond

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

Machine Learning Moves Into Fab And Mask Shop

Using DSA With EUV

Defect Reduction At 7/5nm

The Week In Review: Manufacturing

IIoT And Predictive Maintenance

Variation Spreads At 10/7nm

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