tag: Semiconductor Research Corp.

Running Out Of Energy?
By Ann Mutschler - 16 Mar, 2016 - Comments: 1

The anticipated and growing energy requirements for future computing needs will hit a wall in the next 24 years if the current trajectory is correct. At that point, the world will not produce enough energy for all of the devices that are expected to be drawing power. A report issued by the Semiconductor Industry Association and Semiconductor Research Corp., bases its conclusions on system-le... » read more

DoD Scratches Its Head Over Foundry Security
By Brian Bailey - 25 Jun, 2015 - Comments: 1

When the GlobalFoundries deal with IBM to acquire its foundries closes, as it is slated to sometime during 2015, the U.S. Department of Defense has a small problem on its hands. Military programs no longer will have access to a trusted fab to manufacture semiconductors. How do you ensure that the foundry did not modify or alter your design, add backdoor access or implement a remote control mech... » read more

Quantum Computer Race Heats Up
By Mark LaPedus - 20 Feb, 2014 - Comments: 0

For years, there has been an intense race among various nations to develop the world’s fastest supercomputers. The U.S. and Japan led the field until 2010, when China stunned the market and rolled out the world’s fastest supercomputer. And today, China continues to lead the field with a supercomputer capable of running at speeds of 33.86 petaflops per second. While the supercomputer race... » read more

What’s After CMOS?
By Mark LaPedus - 24 Jan, 2014 - Comments: 3

Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor could scale at least to the 3nm node in the 2021 timeframe. And then, CMOS could run out of gas, prompting the need for a new switch technology. So what’s after the CMOS-based transistor? Carbon nanotubes and graphene get the most a... » read more

Week In Review: Manufacturing & Design
By Mark LaPedus - 25 Oct, 2013 - Comments: 0

Don’t look now, but Intel is expanding its foundry business. Previously, Intel garnered a small collection of foundry customers. But Intel would not entertain foundry customers that had competitive products based on ARM chips. Apparently, Intel is having a change of heart. “I think they’ve changed their position,” said Nathan Brookwood, a research fellow at Insight 64. “They will do A... » read more

What Will Replace Dual Damascene?
By Mark LaPedus - 24 Jan, 2013 - Comments: 0

By Mark LaPedus In the mid-1990s, IBM announced the world’s first devices using a copper dual damascene process. At the time, the dual damascene manufacturing process was hailed as a major breakthrough. The new copper process enabled IC makers to scale the tiny interconnects in a device, as the previous material, aluminum, faced some major limitations. Dual damascene remains the workhorse... » read more

What Comes After FinFETs?
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus The semiconductor industry is currently making a major transition from conventional planar transistors to finFETs starting at 22nm. The question is what’s next? In the lab, IBM, Intel and others have demonstrated the ability to scale finFETs down to 5nm or so. If or when finFETs runs out of steam, there are no less than 18 different next-generation candidates that could o... » read more

The Ins And Outs Of Directed Self-Assembly
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By Mark LaPedus H.S. Phillip Wong, professor of electrical engineering at Stanford University and one of the leading experts on directed self-assembly (DSA) technology, sat down to discuss the future of this approach with Semiconductor Manufacturing & Design. With funding from the Semiconductor Research Corp. (SRC), Stanford is exploring contact-hole patterning and the design infrastructur... » read more

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