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Shortages, Challenges Engulf Packaging Supply Chain


A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

Servers Are Becoming More Heterogeneous


The number of CPUs in a server is growing, and so is the number of vendors that make those processors. CPU server build has been one, two, four, and occasionally more x86 processors, with IBM’s Power and Z series as the major exception. While x86 processors aren't necessarily being replaced, they are being complimented and augmented with new processor designs for a variety of more speciali... » read more

Data Center Evolution: DDR5 DIMMs Advance Server Performance


Driven by a confluence of megatrends, global data traffic is increasing at an exponential rate. For example, 5G networks are enabling billions of AI-powered IoT devices untethered from wired networks. Nowhere is the impact of all this growth being felt more intensely than in data centers. Indeed, hyperscale data centers have become the critical hubs of the global data network. DDR5 DRAM will en... » read more

Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Maximizing Value Post-Moore’s Law


When Moore's Law was in full swing, almost every market segment considered moving to the next available node as a primary way to maximize value. But today, each major market segment is looking at different strategies that are more closely aligned with its individual needs. This diversity will end up causing both pain and opportunities in the supply chain. Chip developers must do more with a ... » read more

How AI In Edge Computing Drives 5G And The IoT


Edge computing, which is the concept of processing and analyzing data in servers closer to the applications they serve, is growing in popularity and opening new markets for established telecom providers, semiconductor startups, and new software ecosystems. It’s brilliant how technology has come together over the last several decades to enable this new space starting with Big Data and the idea... » read more

Week in Review: IoT, Security, Auto


Products/Services Achronix Semiconductor selected the Rambus GDDR6 PHY for its next-generation Speedster7t line of field-programmable gate arrays. The Rambus GDDR6 PHY is used in advanced driver-assistance systems, artificial intelligence, graphics, machine learning, and networking applications. Arm and Marvell Technology Group will work together on design and development of Marvell’s nex... » read more

Week in Review: IoT, Security, Auto


Internet of Things Microsoft has new services and capabilities for Azure-connected Internet of Things devices. There’s a new IoT security tool called Azure Security Center for IoT, which ties in with other tools within Azure IoT Hub. Azure Security Center for IoT uses Azure Security Center, Microsoft’s threat intelligence offering. The new IoT security tool also hooks into Azure Sentinel, ... » read more

Week in Review: IoT, Security, Auto


Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Power Issues Grow For Cloud Chips


Performance levels in traditional or hyperscale data centers are being limited by power and heat caused by an increasing number of processors, memory, disk and operating systems within servers. The problem is so complex and intertwined, though, that solving it requires a series of steps that hopefully add up to a significant reduction across a system. But at 7nm and below, predicting exactly... » read more

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