A Solar Solution For Every Situation

By Suresh Thangavel - 01 Dec, 2022 - Comments: 0

Regardless of where they are used, energy conversion efficiency is paramount in solar power applications (if you are interested in their technical details, here is a blog post for you). Even small improvements reduce energy waste, decrease operating costs, lower spatial and cooling systems requirements, and much more. The semiconductor switches used in energy conversion in photovoltaic (... » read more

Realizing The Future Of Fast EV Charging Through CoolSiC Based Topology Design

By Infineon - 09 Feb, 2022 - Comments: 0

While consumers are keen to reduce their carbon footprint, the move to E-Mobility, especially private electric vehicles (EV), is hindered by the limited charging infrastructure, most notably in fast charging. This white paper reviews the charging landscape and examines implementation approaches for fast DC chargers. Specific focus is placed on chargers delivering 350 kW and more for fast electr... » read more

High-Performance CoolSiC MOSFET Technology With Silicon-Like Reliability

By Infineon - 12 Nov, 2021 - Comments: 0

The performance potential of SiC is indisputable. The key challenge to be mastered is to determine which design approach achieves the biggest success in applications. Click here to read more. » read more

Next-Level Power Density In Solar And Energy Storage With Silicon Carbide MOSFETs

By Infineon - 01 Sep, 2021 - Comments: 0

Latest generation silicon carbide semiconductors enable a significant increase in power conversion efficiency in solar power generation systems and associated energy storage. This white paper describes the applications and outlines how lower loss not only saves energy, but also results in smaller and lighter equipment with lower capital, installation and maintenance costs. Click here to read... » read more

A Revolution For Power Conversion Systems — CoolSiC MOSFET

By Infineon - 09 Jun, 2021 - Comments: 0

Silicon carbide (SiC) transistors are increasingly used in power converters, placing high demands on the size, weight and/or efficiency. The outstanding material properties of SiC enable the design of fastswitching unipolar devices as opposed to bipolar IGBT devices. Thus, solutions which have been up to now possible in the low-voltage world only (< 600 V) are now possible at higher voltages... » read more

High-Performance 300 kW 3-Phase SiC Inverter Based On Next Generation Modular SiC Power Modules

By Wolfspeed, a Cree Company - 21 May, 2020 - Comments: 0

Wolfspeed presents a new high-performance, low-cost, compact 3-phase inverter based on next generation power modules which are specifically optimized to fully utilize Wolfspeed’s third generation of silicon carbide (SiC) MOSFETs. The inverter was designed with a holistic approach with careful consideration of module specifications, busbar technology, DC link capacitors, and a high-performance... » read more

Replenishing The Grid With A SiC-Based Bi-Directional On-Board Charger

By Wolfspeed, a Cree Company - 16 Dec, 2019 - Comments: 0

Range anxiety and charger availability have long been the main hurdles to the adoption of electric vehicles. But even as car makers have demonstrated their batteries can go longer distances and charging stations have proliferated, challenges with EV charging remain as well as opportunities to load balance power grids. The migration to electric vehicles also means looking at how they can bett... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer