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Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems


Abstract: "More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based 2.5-D systems. The division of large system-on-chip dies into smaller chiplets with different technology nodes specific to the chiplet application requirement enables the performance enhancement at the ... » read more

System Bits: Feb. 7


Large scale quantum computer blueprint An international team comprised of researchers from the University of Sussex, Google, Aarhus University, RIKEN, and Siegen University recently unveiled what they say is the first practical blueprint for how to build a quantum computer. The team asserted that once built, the computer would have the potential to answer many questions in science; create n... » read more