tag: Siemens EDA

Can You Build A Known-Good Multi-Die System?
By Ed Sperling - 18 Jun, 2025 - Comments: 0

Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadenc... » read more

Blog Review: June 18
By Jesse Allen - 18 Jun, 2025 - Comments: 0

Synopsys’ John Koeter and other industry experts discuss whether high-bandwidth memory should follow established standards for broad compatibility and scalability or be customized to address specific use case requirements and time-to-market targets. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about how progress in 3D-IC development, thermal management, and the indu... » read more

A Guide To SDC-Based Timing Intent Verification With Questa One
By Siemens EDA - 16 Jun, 2025 - Comments: 0

As semiconductor designs continue to grow in complexity and timing margins become increasingly constrained, achieving predictable timing closure has evolved from a best practice into a critical requirement for first-pass silicon success. At the heart of this process lies the timing constraint file, i.e., the SDC (Synopsys Design Constraints), which defines the intended timing behavior of the de... » read more

Smarter, Faster, Leaner: Rethinking Verification For The Modern Era
By Harry Foster - 12 Jun, 2025 - Comments: 0

Verification isn’t just another step in the semiconductor design process—it’s increasingly the step that defines whether teams hit their schedules or miss the mark. With skyrocketing design complexity, accelerated development timelines, and persistent engineering shortages, the industry is feeling the pressure. Traditional methods aren’t keeping pace. At Siemens, we’ve been rethink... » read more

In-System/In-Field Testing Using High-Quality Deterministic Test Patterns
By Ashrith Harith - 10 Jun, 2025 - Comments: 0

The amount of electronic content in passenger cars is growing rapidly, primarily due to the integration of advanced safety features. The shift towards fully autonomous vehicles, which must comply with stringent safety standards, will further increase the number of electronic components required. Testing efforts must be of exceptional quality. The target test time is often limited to less than 1... » read more

Challenges In Using Sub-7nm ICs In Automotive
By Laura Peters - 10 Jun, 2025 - Comments: 0

The automotive industry is producing vehicles with increasing levels of real-time decision-making, enabled by thousands of ICs, sensors, and multi-chip packages, but making sure these systems work flawlessly throughout their expected lifetimes is a growing challenge. Automotive chips traditionally were developed at mature process nodes in five- to seven-year cycles, but much has changed over... » read more

Rethinking Chip Reliability For Harsh Conditions
By Gregory Haley - 10 Jun, 2025 - Comments: 0

As semiconductors push into environments once considered untenable, reliability expectations are being redefined. From the vacuum of space and the inside of jet engines to deep industrial automation and electrified drivetrains, chips now must endure extreme temperature swings, corrosive atmospheres, mechanical vibration, radiation, and unpredictable power cycles, all while delivering increasing... » read more

Accelerated Assurance For Functional Safety
By Jake Wiltgen - 05 Jun, 2025 - Comments: 0

Today’s electronic systems face unprecedented challenges in ensuring functional safety. As autonomous vehicles navigate our streets, medical devices sustain lives, and industrial automation systems control critical processes, the need for robust safety processes and supporting automation has never been more crucial. The complexity of modern electronic systems, coupled with stringent safety st... » read more

AR/VR Glasses Taking Shape With New Chips
By Liz Allan - 05 Jun, 2025 - Comments: 0

More augmented reality (AR), virtual reality (VR), and mixed reality (MR) wearables are coming, but how they are connected, and where image and other data is processed, are still in flux. Ray-Ban Meta AI glasses, for example, look like classic eyeglasses, but they rely on a tethered smart phone for such functions as taking pictures, AI voice assistance, and object identification. In contrast... » read more

Blog Review: June 4
By Jesse Allen - 04 Jun, 2025 - Comments: 0

In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time ... » read more

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